Compact camera module and method for fabricating the same

1. A compact camera module, comprising:

an image sensor device package;

a back spacer ring disposed on the image sensor device package, wherein a first outside edge of the back spacer ring is aligned to a second outside edge of the image sensor device package;

an optical lens plate disposed over the back spacer ring; and

a front spacer ring sandwiched between the back spacer ring and the optical lens plate, wherein a third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate,

wherein a portion of an upper surface of the back spacer ring is exposed from the front spacer ring.

2. The compact camera module as claimed in claim 1 , wherein the optical lens plate comprises a lens thereon, and a ratio of a width of the lens to a height of the back spacer ring is between 0.4 and 1.3.

3. The compact camera module as claimed in claim 1 , wherein a fifth edge shared by an inner sidewall and a top surface of the back spacer ring is aligned to a sixth edge shared by an inner sidewall and a bottom surface of the front spacer ring.

4. The compact camera module as claimed in claim 3 , wherein a first angle between the inner sidewall and the bottom surface of the back spacer ring is larger than 90 degrees from a cross-section view of the compact camera module.

5. The compact camera module as claimed in claim 3 , wherein a second angle between the inner sidewall and the bottom surface of the front spacer ring is smaller than 90 degrees from a cross-section view of the compact camera module.

6. The compact camera module as claimed in claim 1 , wherein the image sensor device package comprises:

an image sensor device chip;

a transparent plate covering the image sensor device chip;

a dam between the transparent plate and the image sensor device chip, surrounding a first cavity, wherein the image sensor device chip disposed in the first cavity;

an insulating layer formed on a sidewall and a lower surface of the image sensor device chip;

a conductive layer formed over the insulating layer, wherein the conductive layer electrically connects to the image sensor device chip;

a passivation layer covering the lower surface of the sensor chip; and

a conductive bump formed on the passivation layer, electrically connected to the conductive layer.

7. The compact camera module as claimed in claim 6 , further comprising a second cavity surrounded by the transparent plate, the back spacer ring, the front spacer ring and the optical lens plate, wherein the second cavity is aligned to the first cavity.

8. The compact camera module as claimed in claim 7 , wherein the second cavity has a sandglass-shape.

9. The compact camera module as claimed in claim 1 , further comprising a shield surrounding sidewalls of the image sensor device package, the back spacer ring, the front spacer ring and the optical lens plate, wherein an upper surface of the optical lens plate and a lower surface of the image sensor device package are exposed from the shield.

10. The compact camera module as claimed in claim 9 , further comprising a plastic cap over the back spacer ring and surrounding the front spacer ring.

11. The compact camera module as claimed in claim 9 , wherein the shield has a rigid tube shape.

12. The compact camera module as claimed in claim 11 , wherein the shield spaces apart from the sidewalls of the front spacer ring and the optical lens plate.

13. The compact camera module as claimed in claim 11 , wherein the shield spaces apart from the sidewalls of the back spacer ring, the front spacer ring and the optical lens plate.

14. A method for fabricating a compact camera module, comprising:

providing a first portion comprising an image sensor device package with a back spacer ring bonded thereon, wherein a first outside edge of the back spacer ring is aligned to a second outside edge of the image sensor device package, wherein providing the first portion comprises:

providing a wafer having a image sensor device chip;

bonding a transparent plate to an upper surface of the wafer by a dam therebetween;

forming through holes through the wafer, wherein the through holes are adjacent edges of the image sensor device chip;

covering a lower surface of the wafer with a passivation layer;

forming conductive bumps on the passivation layer, electrically connected to the image sensor device chip;

bonding the back spacer ring on the wafer, and connecting to the transparent plate; and

dicing the wafer, the transparent plate and the back spacer ring along the through holes;

providing a second portion comprising an optical lens plate with a front spacer ring bonded thereunder, wherein a third outside edge of the front spacer ring is aligned to a fourth outside edge of the optical lens plate; and

bonding the second portion onto the first portion, wherein the front spacer ring is sandwiched between the back spacer ring and the optical lens plate.

15. The method for fabricating a compact camera module as claimed in claim 14 , wherein providing the second portion comprises:

providing a optical lens plate having a transparent plate and a lens thereon; and

bonding a front spacer ring onto the transparent plate, wherein the front spacer ring surrounds the lens; and

dicing the optical lens plate and the front spacer ring along a scribe line of the optical lens plate.

16. The method for fabricating a compact camera module as claimed in claim 14 , further comprising:

forming a shield surrounding sidewalls of the image sensor device chip, the back spacer ring, the front spacer ring and the optical lens plate, wherein an upper surface of the optical lens plate and a lower surface of the image sensor device chip are exposed from the shield.

17. The method for fabricating a compact camera module as claimed in claim 16 , further comprising:

forming a plastic cap over the back spacer ring and surrounding the front spacer ring.

18. The method for fabricating a compact camera module as claimed in claim 16 , further comprising:

filling a conductive glue into a space between the sidewall of the image sensor package and a sidewall of the shield.