Substrate temperature control fixing apparatus
A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.
1. A substrate temperature control fixing apparatus comprising:
an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on an upper surface of the base body;
a base plate which supports the electrostatic chuck;
a bank portion provided on an outer periphery of an upper surface of the base plate which is opposed to a lower surface of the base body; and
a heating unit provided on an inside of the bank portion, wherein
a surface of the bank portion which is faced to the lower surface of the base body and the lower surface of the base body are fixed to each other through a first bonding layer,
the heating unit is fixed to the lower surface of the base body through the first bonding layer, and
the surface at the first bonding layer side of the heating unit and the surface at the first bonding layer side of the bank portion form a coplanar surface.
2. The substrate temperature control fixing apparatus according to claim 1 , wherein the bank portion takes an annular shape.
3. The substrate temperature control fixing apparatus according to claim 1 , wherein the heating unit is interposed and fixed between the first bonding layer and a second bonding layer formed on the inside of the bank portion.
4. The substrate temperature control fixing apparatus according to claim 3 , wherein a thickness of the second bonding layer is greater than that of the first bonding layer.
5. The substrate temperature control fixing apparatus according to claim 1 , wherein the bank portion and the base plate are made of the same material.
6. The substrate temperature control fixing apparatus according to claim 5 , wherein the bank portion and the base plate are made of aluminum.
7. The substrate temperature control fixing apparatus according to claim 5 , wherein the bank portion is formed integrally with the base plate.