Body controlled double channel transistor and circuits comprising the same
By providing a body controlled double channel transistor, increased functionality in combination with enhanced stability may be accomplished. For instance, flip flop circuits usable for static RAM cells may be formed on the basis of the body controlled double channel transistor, thereby reducing the number of transistors required per cell, which may result in increased information density.
1. A static RAM cell, comprising:
a select transistor having a gate configured to receive a select signal and an input configured to receive at least one of a read signal and a write signal; and
a first field effect transistor comprising:
a gate electrode;
a terminal coupled to the gate electrode;
a drain region and a source region having a first conductivity type adjacent the gate electrode;
a first body region defined between said drain region and said source region and having a second conductivity type that is other than said first conductivity type, wherein said body region is connected to an output of said select transistor to enable selective application of said at least one of a read signal and a write signal to said first body region responsive to said select signal.
2. The static RAM cell of claim 1 , further comprising a second field effect transistor connected to said first field effect transistor, said first and second field effect transistors forming a flip flop circuit for data storage.
3. The static RAM cell of claim 2 , wherein said flip flop circuit comprises an input for receiving said read signal and said write signal.
4. The static RAM cell of claim 2 , wherein said flip flop circuit comprises an input connected to said first body region and an output connect to a gate electrode of said first field effect transistor.
5. The static RAM cell of claim 4 , wherein said output is connected a drain of said first field effect transistor and a gate electrode of said second field effect transistor.
6. The static RAM cell of claim 5 , wherein said input is connected to a drain of said second field effect transistor.
7. The static RAM cell of claim 6 , wherein said second field effect transistor comprises a second body region coupled to a source of said second field effect transistor.
8. The static RAM cell of claim 1 , wherein said first field effect transistor comprises a doped region located between said drain region and said source region, wherein said doped region has said first conductivity type.
9. The static RAM cell of claim 8 , further comprising a second field effect transistor coupled to said first field effect transistor, said second field effect transistor comprising a second body region having said first conductivity type and a second doped region comprising said second conductivity type.
10. The static RAM cell of claim 1 , wherein the select transistor is coupled to a bit line for receiving said at least one read or write signal, further comprising a second field effect transistor connected to said first field effect transistor, said first and second field effect transistors forming a flip flop circuit for data storage, wherein said flip flop circuit comprises an input/output terminal connected to said first body region and a drain of said second field effect transistor.
11. The static RAM cell of claim 10 , wherein a gate of said first field effect transistor, a gate of said second field effect transistor, and a drain of said second field effect transistor are coupled together.
12. The static RAM cell of claim 11 , wherein said second field effect transistor comprises a second body region coupled to a source of said second field effect transistor.