Interconnect for MEMS device including a viscoelastic septum

1. A method of manufacturing a device for use with an elongate structure, the method comprising:

a) forming a generally planar substrate;

b) depositing parylene upon the substrate, and forming a device wall layer by depositing an epoxy resin upon the parylene;

c) forming a septum cavity in the device wall layer;

d) forming a channel formed in the device wall layer in fluid communication with the septum cavity; and

e) forming a septum element disposed in the septum cavity, the septum element formed of a viscoelastic material, the septum element defining a septum entry surface and a septum exit surface, the septum exit surface being exposed to the channel and disposed between the septum entry surface and the channel, the septum element being without any openings formed through the septum element extending between the septum entry and exit surfaces.

2. The method of claim 1 wherein b includes:

spin coating an epoxy resin upon the parylene.

3. The method of claim 2 when b) includes;

curing the epoxy resin into a solid material.

4. The method of claim 1 wherein d) includes:

pouring a polymer in the septum cavity;

curing the polymer to form the septum element.