Depth and breakthrough detection for laser machining

1. A system comprising:

a working laser beam;

a sensing laser beam;

a first optical element for generating a coaxial beam from the working laser beam and the sensing laser beam;

a second optical element for focusing the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece;

an optical sensor for sensing an intensity of the reflected sensing beam;

a motion stage having an aperture, the motion stage positioned proximate the reflected sensing beam such that the motion stage translates an aperture along the sensing beam, wherein

the intensity of the reflected sensing beam is maximized at the optical sensor when the aperture is at a focus position; and

a data acquisition controller, wherein the data acquisition controller:

is capable of determining a machining parameter of the working laser beam based on the focus position; and

is capable of determining a degree of breakthrough based on the intensity of the reflected sensing beam and the focus position.

2. The system of claim 1 , wherein the sensing laser beam has a different wavelength from the working laser beam.

3. The system of claim 1 , wherein the controller determines the degree of breakthrough by:

moving the aperture along the reflected sensing beam to maximize the intensity of the reflected sensing beam at the optical sensor; and

determining the machining parameter based on the focus position and the intensity of the reflected sensing beam.

4. The system of claim 1 , wherein the machining parameter is indicative of breakthrough of the working laser beam.

5. The system of claim 4 , wherein the controller ceases pulsing of the working laser beam based on the breakthrough.

6. The system of claim 1 , wherein the machining parameter is indicative of a machining depth of the working laser beam.

7. The system of claim 6 , wherein the controller modulates the working laser beam based on the machining depth.

8. The system of claim 7 , wherein the controller modulates the working laser beam such that the intensity of the working laser beam is reduced during breakthrough.

9. The system of claim 1 , wherein the machining parameter is indicative of a surface feature machined onto the workpiece by the working laser.

10. The system of claim 1 , wherein the machining parameter is indicative of a surface coating removed from the workpiece by the working laser.

11. A laser system comprising:

a first laser for generating a working beam;

a second laser for generating a sensing beam;

a dichroic element positioned to form a coaxial beam by transmitting the working beam along a coaxial beampath and reflecting the sensing beam along the coaxial beampath;

a focusing element positioned to focus the coaxial beam onto a workpiece, such that the working beam machines the workpiece and the sensing beam reflects from the workpiece;

a sensor positioned to sense an intensity of the reflected sensing beam;

a translating aperture positioned on a motion stage, wherein the translating aperture is positioned at a focus position of the reflected sensing beam by the motion stage, and the translating aperture and motion stage are movable longitudinally along the reflected sensing beam; and

a controller coupled to the first laser for controlling an intensity of the working beam based on the focus position and the sensed intensity of the reflected sensing beam.

12. The laser system of claim 11 , further comprising a processor for determining breakthrough of the working beam based on the focus position and the intensity of the reflected sensing beam.

13. The laser system of claim 12 , where the controller controls the intensity of the working beam by ceasing pulsing of the first laser based on the breakthrough.

14. The laser system of claim 11 , further comprising a processor for determining a machining depth of the working beam based on the focus position.

15. The laser system of claim 14 , wherein the controller controls the intensity of the working beam by modulating a power output of the first laser based on the machining depth.

16. A laser system for machining a workpiece, the system comprising:

a first laser producing a first laser beam at a first characteristic wavelength;

a second laser producing a second laser beam at a second characteristic wavelength, different from the first characteristic wavelength;

a dichroic reflector positioned to transmit one of the first and second laser beams along a coaxial beampath and to reflect another of the first and second laser beams along the coaxial beampath;

a lens positioned in the coaxial beampath to focus the first and second laser beams onto the workpiece, such that the first laser beam ablates the workpiece to form a feature and the second laser beam reflects from the workpiece to form a sensing beam;

a photosensor positioned in the reflected sensing beam, such that the photosensor senses a reflected intensity of the second laser beam;

a motion stage positioned proximate the reflected sensing beam, such that the motion stage translates an iris to a focus point along the sensing beam; and

a laser controller coupled to the first laser, such that the laser controller controls a depth of the feature based on the reflected intensity and the focus point.

17. The laser system of claim 16 , wherein the laser controller controls the depth of the feature by modulating a power output of the first laser based on the focus point.

18. The laser system of claim 16 , wherein the laser controller controls the depth of the feature by ceasing pulsing of the first laser based on breakthrough.

19. The laser system of claim 16 , wherein the laser controller modulates the power output of the first laser such that the power output is reduced during breakthrough.

20. The laser system of claim 16 , wherein the laser controller ceases pulsing of the first laser based on removal of a surface coating from the workpiece.