Target-based thermal design using dummy insertion for semiconductor devices
The present disclosure provides integrated circuit methods for target-based dummy insertion. A method includes providing an integrated circuit (IC) design layout, and providing a thermal model for simulating thermal effect on the IC design layout, the thermal model including optical simulation and silicon calibration. The method further includes providing a convolution of the thermal model and the IC design layout to generate a thermal image profile of the IC design layout, defining a thermal target for optimizing thermal uniformity across the thermal image profile, comparing the thermal target and the thermal image profile to determine a difference data, and performing thermal dummy insertion to the IC design layout based on the difference data to provide a target-based IC design layout.
1. An integrated circuit design method, comprising:
providing an integrated circuit (IC) design layout;
providing a thermal model for simulating thermal effect on the IC design layout, the thermal model including optical simulation and silicon calibration;
providing a convolution of the thermal model and the IC design layout to generate a thermal image profile of the IC design layout;
defining a thermal target for optimizing thermal uniformity across the thermal image profile;
comparing, by a processor, the thermal target and the thermal image profile to determine a difference data; and
performing, by a processor, thermal dummy insertion to the IC design layout based on the difference data to provide a target-based IC design layout.
2. The method of claim 1 , wherein the optical simulation includes rigorous coupled-wave analysis (RCWA) optical simulation.
3. The method of claim 1 , wherein defining the thermal target includes defining an absorption target, a reflectivity target, and/or a pattern-density target for the IC design layout.
4. The method of claim 1 , wherein performing thermal dummy insertion to the IC design layout follows a model-based rule.
5. The method of claim 4 , wherein performing thermal dummy insertion to the IC design layout includes inserting uni-pitch and uni-size thermal dummy features as dummy seed features.
6. The method of claim 4 , wherein performing thermal dummy insertion to the IC design layout includes sizing the thermal dummy features depending on the difference data.
7. The method of claim 1 , wherein performing thermal dummy insertion to the IC design layout optimizes thermal uniformity and topographical uniformity.
8. The method of claim 1 , further comprising:
simulating thermal effect on the target-based IC design layout;
simulating electrical performance on the target-based IC design layout; and
determining if electrical performance of the target-based IC design layout is within an acceptable performance threshold.
9. The method of claim 8 , wherein the simulating thermal effect includes simulating reflection, transmission, and/or absorption of a radiation beam during an annealing process.
10. The method of claim 8 , wherein the simulating electrical performance includes extracting at least one of saturation current and threshold voltage from the target-based IC design layout.
11. The method of claim 8 , further comprising:
if electrical performance is not within the performance threshold,
repeating thermal dummy insertion to the IC design layout based on subsequent difference data to provide a subsequent target-based IC design layout, the repeating thermal dummy insertion including at least one of adding, removing, repositioning, resizing, and/or reshaping thermal dummy features,
repeating the simulating thermal effect,
repeating the simulating electrical performance, and
determining if electrical performance of the subsequent target-based IC design layout is within the acceptable performance threshold.
12. The method of claim 8 , further comprising:
if electrical performance is within the performance threshold,
fabricating a mask based on the target-based IC design layout, and
fabricating a wafer using the mask.
13. An integrated circuit design method, comprising:
providing an integrated circuit (IC) design layout;
providing a thermal model for simulating thermal effect on the IC design layout, the thermal model including rigorous coupled-wave analysis (RCWA) optical simulation and silicon calibration;
providing a convolution of the thermal model and the IC design layout to generate a thermal image profile of the IC design layout;
defining a thermal target for optimizing thermal uniformity across the thermal image profile, the thermal target including an absorption target, a reflectivity target, and/or a pattern-density target for the IC design layout;
comparing, by a processor, the thermal target and the thermal image profile to determine a difference data; and
performing, by a processor, thermal dummy insertion to the IC design layout based on the difference data to provide a target-based IC design layout, wherein the thermal dummy insertion follows a model-based rule to optimize thermal uniformity and topographical uniformity.
14. The method of claim 13 , wherein performing thermal dummy insertion to the IC design layout includes inserting uni-pitch and uni-size thermal dummy features as dummy seed features.
15. The method of claim 13 , wherein performing thermal dummy insertion to the IC design layout includes sizing the thermal dummy features depending on the difference data.
16. The method of claim 13 , further comprising:
simulating thermal effect on the target-based IC design layout;
simulating electrical performance on the target-based IC design layout; and
determining if electrical performance of the target-based IC design layout is within an acceptable performance threshold.
17. The method of claim 16 , wherein the simulating thermal effect includes simulating reflection, transmission, and/or absorption of a radiation beam during an annealing process.
18. The method of claim 16 , wherein the simulating electrical performance includes extracting at least one of saturation current and threshold voltage from the target-based IC design layout.
19. The method of claim 16 , further comprising:
if electrical performance is not within the performance threshold,
repeating thermal dummy insertion to the IC design layout based on subsequent difference data to provide a subsequent target-based IC design layout, the repeating thermal dummy insertion including at least one of adding, removing, repositioning, resizing, and/or reshaping thermal dummy features,
repeating the simulating thermal effect,
repeating the simulating electrical performance, and
determining if electrical performance of the subsequent target-based IC design layout is within the acceptable performance threshold.
20. The method of claim 16 , further comprising:
if electrical performance is within the performance threshold, fabricating a mask based on the target-based IC design layout, and
fabricating a wafer using the mask.