Method of fabricating flexible display device
A method of fabricating a flexible display device includes: forming a plastic substrate on a carrier substrate, the plastic substrate including an active area and a non-active area surrounding the active area; forming an array element on the carrier substrate, the array element including a plurality of layers and having an average adhesion force among the plurality of layers; forming a first film on the array element, the first film having a first adhesion force; attaching a flexible printed circuit board to the plastic substrate; forming a second film on the first film, the second film having a second adhesion force greater than the first adhesion force; and detaching the plastic substrate from the carrier substrate.
1. A method of fabricating a flexible display device, comprising:
forming a plastic substrate on a carrier substrate, the plastic substrate including an active area, and a non-active area surrounding the active area;
forming an array element on the plastic substrate, the array element including a plurality of layers and having an average adhesion force among the plurality of layers;
forming a first film on the array element, the first film having a first adhesion force;
attaching a flexible printed circuit board to the plastic substrate;
forming a second film on the first film, the second film having a second adhesion force greater than the first adhesion force; and
detaching the plastic substrate from the carrier substrate.
2. The method according to claim 1 , wherein the first film is formed to cover the active area and a portion of the non-active area.
3. The method according to claim 1 , wherein the second film is formed to cover the first film and a portion of the flexible printed circuit board.
4. The method according to claim 1 , wherein forming the plastic substrate comprises:
coating a liquid plastic material on the carrier substrate; and
curing the liquid plastic material through a heat treatment.
5. The method according to claim 1 , wherein forming the plastic substrate comprises attaching a film type plastic sheet to the carrier substrate.
6. The method according to claim 1 , wherein the first adhesion force is about 0.9 times to about 1.1 times of the average adhesion force.
7. The method according to claim 1 , wherein the first film includes one of polyimide (PI), polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and polyether sulfone (PES).
8. The method according to claim 1 , wherein the second adhesion force is greater than an adhesion force between the carrier substrate and the plastic substrate and is about 3 times to 5 times of the average adhesion force.
9. The method according to claim 1 , wherein the second film includes a polarizing plate.
10. The method according to claim 1 , wherein forming the array element comprises forming a switching thin film transistor, a driving thin film transistor and an organic electroluminescent diode.
11. The method according to claim 10 , wherein forming the array element further comprises:
forming a gate line, a data line and a power line, the gate line and the data line crossing each other, and the power line parallel to and spaced apart from the data line, wherein the switching thin film transistor is connected to the gate line and the data line, and wherein the driving thin film transistor is connected to the switching thin film transistor and the power line; and
forming a passivation layer on the switching thin film transistor and the driving thin film transistor.
12. The method according to claim 11 , wherein forming the organic electroluminescent diode comprises:
forming a first electrode on the passivation layer, the first electrode connected to the driving thin film transistor;
forming an organic emitting layer on the first electrode; and
forming a second electrode on the organic emitting layer.
13. The method according to claim 12 , wherein forming the organic electroluminescent diode further comprises forming a bank layer on the first electrode, and wherein the organic emitting layer has a multiple-layer structure including a hole injection layer, a hole transporting layer, an emitting material layer, an electron transporting layer, and an electron injection layer.
14. The method according to claim 1 , comprising applying a force to the carrier substrate after one end of the second film outside the carrier substrate is fixed by one of a vacuum adsorption and a clamp to detach the plastic substrate from the carrier substrate.
15. The method according to claim 1 , further comprising:
forming an adhesion mitigating layer of an inorganic material on an entire surface of the carrier substrate; and
forming an adhesion reinforcing layer of a metallic material on the adhesion mitigating layer, the adhesion reinforcing layer having one of a lattice shape and a rectangular ring shape surrounding the display area.
16. The method according to claim 15 , wherein the carrier substrate includes a glass, wherein the adhesion mitigating layer includes one of silicon oxide (SiO 2 ) and silicon nitride (SiNx), and wherein the adhesion reinforcing layer includes one of molybdenum (Mo), molybdenum tungsten (MoW), molybdenum titanium (MoTi), aluminum (Al), aluminum neodymium (AINd), copper (Cu), amorphous indium-tin-oxide (a-ITO) and indium-gallium-zinc-oxide (IGZO).