Method for manufacturing semiconductor device
A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.
1. A method for manufacturing a semiconductor device comprising:
forming a first multi-component oxide semiconductor layer over a substrate;
forming a single-component oxide semiconductor layer over the first multicomponent oxide semiconductor layer;
performing a first heat treatment to form a single-component oxide semiconductor layer including single crystal regions and to perform crystal growth of the first multi-component oxide semiconductor layer from the single-component oxide semiconductor layer including single crystal regions so as to form a first multicomponent oxide semiconductor layer including single crystal regions;
forming a second multi-component oxide semiconductor layer over the single-component oxide semiconductor layer including single crystal regions; and
performing a second heat treatment to form a second multi-component oxide semiconductor layer including single crystal regions.
2. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
etching a stack of the first multi-component oxide semiconductor layer, the single-component oxide semiconductor layer, and the second multi-component oxide semiconductor layer into an island-shape;
forming a source electrode and a drain electrode over the stack;
forming a gate insulating layer over the source electrode and the drain electrode; and
forming a gate electrode over the gate insulating layer.
3. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a gate electrode and a gate insulating layer over the substrate before formation of the first multi-component oxide semiconductor layer;
etching a stack of the first multi-component oxide semiconductor layer, the single-component oxide semiconductor layer, and the second multi-component oxide semiconductor layer into an island-shape; and
forming a source electrode and a drain electrode over the stack.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the first heat treatment and the second heat treatment is performed at higher than or equal to 500° C. and lower than or equal to 1000° C.
5. The method for manufacturing a semiconductor device according to claim 1 , wherein crystal growth of the first multi-component oxide semiconductor layer is carried out using the single-component oxide semiconductor layer including single crystal regions as a seed crystal to form the single crystal regions in the first multi-component oxide semiconductor layer.
6. The method for manufacturing a semiconductor device according to claim 1 , wherein crystal growth of the second multi-component oxide semiconductor layer is carried out using the single-component oxide semiconductor layer including single crystal regions as a seed crystal to form the single crystal regions in the second multi-component oxide semiconductor layer.
7. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the single-component oxide semiconductor layer including single crystal regions, the first multi-component oxide semiconductor layer including single crystal regions, and the second multi-component oxide semiconductor layer including single crystal regions has an a-b plane parallel to a surface of the substrate and a c-axis perpendicular to the surface of the substrate.
8. The method for manufacturing a semiconductor device according to claim 1 , wherein the single-component oxide semiconductor layer has a hexagonal crystal structure.
9. The method for manufacturing a semiconductor device according to claim 1 , wherein the single-component oxide semiconductor layer comprises zinc oxide.
10. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the single-component oxide semiconductor layer including single crystal regions, the first multi-component oxide semiconductor layer including single crystal regions, and the second multi-component oxide semiconductor layer including single crystal regions is dehydrated or dehydrogenated.
11. The method for manufacturing a semiconductor device according to claim 1 , wherein a carrier density of each of the single-component oxide semiconductor layer including single crystal regions, the first multi-component oxide semiconductor layer including single crystal regions, and the second multi-component oxide semiconductor layer including single crystal regions is lower than 1×10 14 cm −3 .
12. The method for manufacturing a semiconductor device according to claim 1 , wherein a carrier density of each of the single-component oxide semiconductor layer including single crystal regions, the first multi-component oxide semiconductor layer including single crystal regions, and the second multi-component oxide semiconductor layer including single crystal regions is lower than 1.45×10 10 cm −3 .
13. The method for manufacturing a semiconductor device according to claim 1 , wherein each of the single-component oxide semiconductor layer including single crystal regions, the first multi-component oxide semiconductor layer including single crystal regions, and the second multi-component oxide semiconductor layer including single crystal regions is intrinsic semiconductor.
14. The semiconductor device according to claim 1 , wherein the second heat treatment is performed at higher than or equal to 150° C. and lower than or equal to 400° C.
15. A method for manufacturing a semiconductor device comprising:
forming a first multi-component oxide semiconductor layer over a substrate;
forming a single-component oxide semiconductor layer over the first multicomponent oxide semiconductor layer;
performing a heat treatment to form a single-component oxide semiconductor layer including single crystal regions and to perform crystal growth of the first multicomponent oxide semiconductor layer from the single-component oxide semiconductor layer including single crystal regions so as to form a first multi-component oxide semiconductor layer including single crystal regions; and
forming a second multi-component oxide semiconductor layer including single crystal regions over the single-component oxide semiconductor layer by a sputtering method while performing heating.
16. The semiconductor device according to claim 15 , wherein the heating temperature of forming the second multi-component oxide semiconductor layer including single crystal regions is at 200° C. to 600° C.
17. The method for manufacturing a semiconductor device according to claim 15 , further comprising:
etching a stack of the first multi-component oxide semiconductor layer, the single-component oxide semiconductor layer, and the second multi-component oxide semiconductor layer into an island-shape;
forming a source electrode and a drain electrode over the stack;
forming a gate insulating layer over the source electrode and the drain electrode; and
forming a gate electrode over the gate insulating layer.
18. The method for manufacturing a semiconductor device according to claim 15 , further comprising:
forming a gate electrode and a gate insulating layer over the substrate before formation of the first multi-component oxide semiconductor layer;
etching a stack of the first multi-component oxide semiconductor layer, the single-component oxide semiconductor layer, and the second multi-component oxide semiconductor layer into an island-shape; and
forming a source electrode and a drain electrode over the stack.