Radiation-sensitive resin composition, method for forming a resist pattern, compound, and polymer
A radiation-sensitive resin composition includes a first polymer that includes a repeating unit having an acid-labile group and becomes alkali-soluble upon dissociation of the acid-labile group, and a radiation-sensitive acid-generating agent. The acid-labile group has a structure shown by a general formula (1). R 1 represents a methyl group or the like, R 2 represents a hydrocarbon group that forms a cyclic structure, R 3 represents a fluorine atom or the like, R 4 represents a carbon atom, and n 1 is an integer from 1 to 7.
1. A radiation-sensitive resin composition comprising:
a first polymer which includes a repeating unit having an acid-labile group and which becomes alkali-soluble upon dissociation of the acid-labile group; and
a radiation-sensitive acid-generating agent, wherein the acid-labile group has a structure shown by a general formula (1),
wherein R 1 represents a monovalent hydrocarbon group having 1 to 5 carbon atoms, R 2 represents a divalent hydrocarbon group that is bonded to R 4 to form a cyclic structure, the cyclic structure formed by R 2 and R 4 is a cyclopentyl group, a cyclohexyl group or a 2-adamantyl group, R 3 represents a fluorine atom or a trifluoromethyl group, the structure shown by the general formula (1) includes 7 or less fluorine atoms in total, R 4 represents a carbon atom, n 1 is an integer from 1 to 4, and a fluorine atom is not bonded to a carbon atom of the divalent hydrocarbon group represented by R 2 that is adjacent to the carbon atom represented by R 4 .
2. The radiation-sensitive resin composition according to claim 1 , wherein the repeating unit having the acid-labile group is a repeating unit shown by a general formula (Ia),
wherein R 5 represents a hydrogen atom, a methyl group, or a trifluoromethyl group, and X 1 represents the structure shown by the general formula (1).
3. A method for forming a resist pattern comprising:
forming a resist film on a substrate using the radiation-sensitive resin composition according to claim 2 ;
exposing the resist film via an immersion liquid provided over the resist film; and
developing the exposed resist film to form a resist pattern.
4. The radiation-sensitive resin composition according to claim 1 , further comprising a second polymer that includes a repeating unit having an acid-labile group, and differs from the first polymer.
5. The radiation-sensitive resin composition according to claim 4 , wherein the amount of the first polymer is 0.1 to 20 parts by mass based on 100 parts by mass of the second polymer.
6. A method for forming a resist pattern comprising:
forming a resist film on a substrate using the radiation-sensitive resin composition according to claim 1 ;
exposing the resist film via an immersion liquid provided over the resist film; and
developing the exposed resist film to form a resist pattern.
7. A compound shown by a general formula (2),
wherein R 5 represents a hydrogen atom, a methyl group, or a trifluoromethyl group, and X 3 represents a structure shown by a general formula (1),
wherein R 1 represents a monovalent hydrocarbon group having 1 to 5 carbon atoms, R 2 represents a divalent hydrocarbon group that is bonded to R 4 to form a cyclic structure, the cyclic structure formed by R 2 and R 4 is a cyclopentyl group, a cyclohexyl group or a 2-adamantyl group, R 3 represents a fluorine atom or a trifluoromethyl group, and the structure shown by the general formula (1) includes 7 or less fluorine atoms in total, R 4 represents a carbon atom, n 1 is an integer from 1 to 4, and a fluorine atom is not bonded to a carbon atom of the divalent hydrocarbon group represented by R 2 that is adjacent to the carbon atom represented by R 4 .
8. A polymer comprising a repeating unit derived from the compound according to claim 7 .