Method for forming metal contacts
Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.
1. A method comprising:
a) providing a liquid suspension burn-through metal ink;
b) selectively applying the liquid suspension burn-through metal ink to an antireflective coating on a semiconductor substrate by inkjet or aerosol;
c) firing the semiconductor substrate with the antireflective coating and the liquid suspension burn-through metal ink to provide Ohmic contact between metal from the liquid suspension burn-through metal ink and the semiconductor substrate; and
d) depositing one or more layers of a metal on the metal from the liquid suspension burn-through metal ink by light induced plating.
2. The method of claim 1 , wherein the liquid suspension burn-through metal ink comprises metal in the form of metal powder, metal salts, metal organic compounds, metal complexes or mixtures thereof.
3. The method of claim 2 , wherein the metal are particles having diameters of about 1000 nm or less.
4. The method of claim 2 , wherein the metal is chosen from silver, gold, palladium, platinum, copper, tin, nickel, cobalt, iron and lead.
5. The method of claim 1 , wherein the liquid suspension burn-through metal ink comprises one or more of glass frits, metal salts, metal complexes and metal organic compounds.
6. The method of claim 5 , wherein the glass frit are particles having diameters of about 1000 nm or less.
7. The method of claim 6 , wherein the glass frit is particles having diameters of about 50 nm to 200 nm.
8. The method of claim 5 , wherein the glass frit comprises one or more oxides chosen from PbO, SiO 2 , B 2 O 3 , ZnO, Bi 2 O 3 , SnO 2 and Al 2 O 3 .
9. The method of claim 1 , wherein heating is done at temperatures of at least about 400° C.
10. The method of claim 1 , wherein the metal layers deposited by light induced plating are chosen from silver, gold, palladium, platinum, copper, tin, nickel, cobalt, iron and lead.
11. The method of claim 1 , wherein the metal layers deposited by light induced plating are about 5 microns to 20 microns thick.
12. The method of claim 1 , wherein a viscosity of the liquid suspension burn-through metal ink is about 1 to 100 cP at 25° C.
13. The method of claim 12 , wherein the viscosity of the liquid burn-through metal ink is about 5 to 75 cP at 25° C.