EMI-shielding solutions for computer enclosures using combinations of two and three-dimensional shapes formed in sheet metal
The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated.
1. A computer enclosure including: a first sheet made of at least partially-conductive material, in which at least four sides are made of a single sheet; and a second sheet, said second sheet providing at least one additional side; in which a -channel including a semi-cylinder is formed into each of said first sheet and said second sheet, such that said three-dimensional channel in said second sheet mates with said channel in said first sheet in the semi-cylinder wherein a curvilinear interface is formed between said two surfaces in said channels including a gap portion and a contact portion, said gap portion providing capacitance and said contact portion providing conductance for EMI containment.
2. The enclosure as recited in claim 1 , wherein the at least partially-conductive material is mild steel.
3. The computer enclosure recited in claim 1 , wherein there is electrical contact along two at least partial lines longitudinally between said first and second channels, said contact configured in said semi-cylinders.
4. An enclosure for electronics formed from at least a first conductive sheet and a second conductive sheet, where said first conductive sheet includes a formed continuous semi-cylindrical channel mated into a continuous semi-cylindrical channel formed into said second conductive sheet, wherein a curvilinear interface is formed between said mating of said first semi-cylindrical channel and said second semi-cylindrical channel, said curvilinear interface including a gap portion and a contact portion and said gap portion providing capacitance and said contact portion providing conductance where said semi-cylindrical channels contact each other.
5. The enclosure as recited in claim 4 , wherein said semi-cylindrical channels contact each other along a single line along said semi-cylindrical channels.
6. The enclosure as recited in claim 4 , wherein said semi-cylindrical channels contact each other along two lines of said semi-cylindrical channels.
7. The enclosure as recited in claim 4 , wherein said contact is provided by a single line with multiple points of contact.
8. The enclosure as recited in claim 4 , wherein said contact is provided by at least two lines with multiple points of contact.
9. The enclosure as recited in claim 4 , wherein said semi-cylindrical channels are configured such that when placed in mating position, compression is provided which keeps said first and said conductive sheets in position.
10. The enclosure as recited in claim 4 , where in said sheets are conductive or semi-conductive.
11. An enclosure for providing improved electromagnetic interference (EMI) shielding, including two conductive sheets, each formed with a semi-cylindrical channel running the length of a least one side and configured such that one of said semi-cylindrical channels is nested inside said other semi-cylindrical channel, and including at least one contact line or multiple points of contact between said nested semi-cylindrical channels, wherein said surface properties formed by said nested semi-cylindrical channels, include a gap portion and a contact portion, said gap portion providing capacitance and said contact portion providing conductance, said conductance and capacitance dissipating energy in the form of thermal heat.
12. The enclosure as recited in claim 11 , wherein there are a least two contact lines.
13. The enclosure as recited in claim 11 wherein said conductive sheet is mild steel.