Semiconductor memory device
According to one embodiment, a semiconductor memory device is disclosed. The device includes MOSFET1 and MOSFET2 arranged in a first direction, variable resistive element (hereafter R1) above MOSFET1 and MOSFET2, a lower end of the R1 being connected to drains of MOSFET1 and MOSFET2, MOSFET3 and MOSFET4 arranged in the first direction, variable resistive element (hereafter R2) above MOSFET3 and MOSFET4, and a lower end of the R2 being connected to drains of MOSFET3 and MOSFET4. The device further includes first wiring line extending in the first direction and connected to sources of MOSFET1 and MOSFET2, second wiring line extending in the first direction and connected to sources of MOSFET3 and MOSFET4, upper electrode connecting upper end of the R1 and upper end of the R2, and third wiring line extending in the first direction and connected to the upper electrode.
1. A semiconductor memory device comprising:
a first MOSFET and a second MOSFET arranged in a first direction and provided on a semiconductor substrate;
a first variable resistive element provided above the first and second MOSFETs, a lower end of the first variable resistive element being connected to drains of the first and second MOSFETs;
a third MOSFET and a fourth MOSFET arranged in the first direction and provided on the semiconductor substrate;
a second variable resistive element provided above the third and fourth MOSFETs, a lower end of the second variable resistive element being connected to drains of the third and fourth MOSFETs;
a first wiring line extending in the first direction and connected to sources of the first and second MOSFETs;
a second wiring line extending in the first direction and connected to sources of the third and fourth MOSFETs;
an upper electrode connecting an upper end of the first variable resistive element and an upper end of the second variable resistive element;
a third wiring line extending in the first direction and connected to the upper electrode,
wherein the first wiring line, the second wiring line, and the third wiring line are provided in a same layer.
2. The device according to claim 1 , wherein the first variable resistive element and the second variable resistive element is arranged in a second direction perpendicular to the first direction.
3. The device according to claim 1 , wherein the upper electrode is connected to the third wiring line via a plug.
4. The device according to claim 1 , wherein the first MOSFET, the second MOSFET and the first variable resistive element constitute a first memory cell, the third MOSFET, the fourth MOSFET and the second variable resistive element constitute a second memory cell, the first and second memory cells constitute a cell unit, and a checkered pattern is formed by cell units, each of cell units is identical to the cell unit.
5. The device according to claim 1 , further comprises a pattern layout of plugs, and wherein the pattern layout of the plugs includes a layout in which number of plugs most adjacent to one plug is four, and the four plugs are arranged at four vertex of a square when the one plug is positioned in a center of the square.
6. The device according to claim 1 , wherein the first and second wiring lines are source lines, the third wiring line is a bit line, and the third wiring line is formed between the first wiring line and the second wiring line.
7. The device according to claim 1 , wherein the variable resistive element is connected to the drain of the MOSFET via a plug, and a center of the variable resistive element is shifted from a center of the plug.
8. The device according to claim 1 , wherein the variable resistive element has a planar shape of rhombus.
9. The device according to claim 1 , wherein the first and second variable resistive elements are MTJ (magnetic tunnel junction) elements.
10. A semiconductor memory device comprising:
a first MOSFET and a second MOSFET arranged in a first direction and provided on a semiconductor substrate;
a first variable resistive element provided above the first and second MOSFETs, a lower end of the first variable resistive element being connected to drains of the first and second MOSFETs;
a third MOSFET and a fourth MOSFET arranged in the first direction and provided on the semiconductor substrate;
a second variable resistive element provided above the third and fourth MOSFETs, a lower end of the second variable resistive element being connected to drains of the third and fourth MOSFETs;
a first wiring line extending in the first direction and connected to sources of the first and second MOSFETs;
a second wiring line extending in the first direction and connected to sources of the third and fourth MOSFETs;
an upper electrode connecting an upper end of the first variable resistive element and an upper end of the second variable resistive element;
a third wiring line extending in the first direction and connected to the upper electrode,
wherein the first MOSFET, the second MOSFET and the first variable resistive element constitute a first memory cell, the third MOSFET, the fourth MOSFET and the second variable resistive element constitute a second memory cell, the first and second memory cells constitute a cell unit, and a checkered pattern is formed by cell units, each of cell units is identical to the cell unit, and
the device further comprises a pattern layout of plugs, the plugs including plugs for connecting sources of the first MOSFETs and the second MOSFETs of the cell units with the first wiring line, plugs for connecting sources of the third MOSFETs and the fourth MOSFETs of the cell units with the second wiring line, plugs for connecting the first variable resistive elements and the second variable resistive elements of the cell units with the upper electrode, and wherein the pattern layout of the plugs includes a layout in which number of plugs most adjacent to one plug is four, and the four plugs are arranged at four vertex of a square when the one plug is positioned in a center of the square.
11. A semiconductor memory device comprising:
a first MOSFET and a second MOSFET arranged in a first direction and provided on a semiconductor substrate;
a first variable resistive element provided above the first and second MOSFETs, a lower end of the first variable resistive element being connected to drains of the first and second MOSFETs;
a third MOSFET and a fourth MOSFET arranged in the first direction and provided on the semiconductor substrate;
a second variable resistive element provided above the third and fourth MOSFETs, a lower end of the second variable resistive element being connected to drains of the third and fourth MOSFETs;
a first wiring line extending in the first direction and connected to sources of the first and second MOSFETs;
a second wiring line extending in the first direction and connected to sources of the third and fourth MOSFETs;
an upper electrode connecting an upper end of the first variable resistive element and an upper end of the second variable resistive element;
a third wiring line extending in the first direction and connected to the upper electrode;
wherein the first and second wiring lines are source lines, the third wiring line is a bit line, and the third wiring line is formed between the first wiring line and the second wiring line.