IP Library Granted Patent US 8,545,657
Granted Patent B2
US 8,545,657 · App. 12/610,050 · Granted Oct 1, 2013

Methods for tape fabrication of continuous filament composite parts and articles of manufacture thereof

Inventor: Andrew H. Weisberg (San Francisco, CA)
Assignee: Lawrence Livermore National Security, LLC
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Quick Facts
Patent No.
US 8,545,657
App. No.
12/610,050
Granted
Oct 1, 2013
Kind
B2
Abstract

A method for forming a composite structure according to one embodiment includes forming a first ply; and forming a second ply above the first ply. Forming each ply comprises: applying a bonding material to a tape, the tape comprising a fiber and a matrix, wherein the bonding material has a curing time of less than about 1 second; and adding the tape to a substrate for forming adjacent tape winds having about a constant distance therebetween. Additional systems, methods and articles of manufacture are also presented.

Claims (34)

1. A method for forming a composite structure, the method comprising:

forming a first ply; and forming a second ply above the first ply, wherein forming each ply comprises:

applying a bonding material to a tape, the tape comprising a fiber and a matrix,

wherein the bonding material has a curing time of less than about 1 second;

adding the tape to a substrate for forming adjacent tape winds having about a constant distance therebetween,

wherein the tape is applied to the substrate at rate of greater than about 15 meters/second.

2. The method of claim 1 , wherein the tape is applied to the substrate at a rate of greater than about 0.894 meter/second.

3. The method of claim 1 , wherein the tape is applied to the substrate at a rate of greater than about 10 meters/second.

4. The method of claim 1 , wherein the tape is applied to the substrate at a rate of greater than about 25 meters/second.

5. The method of claim 1 , with the proviso that no curing step is performed after applying the tape to the substrate.

6. The method of claim 1 , wherein the bonding material has a curing time of less than about 100 milliseconds.

7. The method of claim 1 , wherein upper surfaces of the tape winds in each ply lie along a substantially straight line oriented perpendicular to longitudinal axes of the tape in each wind and parallel to the upper surfaces thereof.

8. The method of claim 1 , wherein edges of the tape winds in the first ply are offset from edges of the tape winds in the second ply.

9. The method of claim 8 , wherein the edges of the tape winds are squared, wherein the tape winds form a brickwork pattern.

10. The method of claim 8 , wherein the edges of the tape winds are beveled.

11. The method of claim 1 , wherein the edges of the tape winds are beveled.

12. The method of claim 1 , wherein the tape winds in at least one of the plies are a continuous piece of tape.

13. The method of claim 1 , wherein the tape winds in at least one of the plies are discrete pieces of tape.

14. The method of claim 1 , wherein adjacent tape winds in each ply are offset from each other in a direction perpendicular to the tape surfaces.

15. The method of claim 14 , wherein the edges of the tape winds are double beveled.

16. The method of claim 1 , wherein longitudinal axes of the tape winds in the first ply are oriented at an angle of between 0 and 180 degrees from longitudinal axes of the tape winds in the second ply.

17. The method of claim 1 , further comprising forming the tape by infusing the matrix into the fiber and curing the matrix.

18. A method for forming a composite structure, the method comprising:

forming a first ply; and

forming a second ply above the first ply,

wherein forming each ply comprises:

applying a bonding material to a tape, the tape comprising a fiber and a matrix, wherein the bonding material has a curing time of less than about 1 second;

adding the tape to a substrate for forming adjacent tape winds having about a constant distance therebetween,

wherein the tape is applied to the substrate at a rate of greater than about 15 meters/second,

with the proviso that no curing step is performed after applying the tape to the substrate.

19. The method of claim 1 , wherein the bonding material is applied to the tape as the tape is added to the substrate.

20. The method of claim 1 , wherein the tape is added to the substrate after the bonding material is added thereto.

21. The method of claim 1 , wherein each ply is formed with about zero net heat addition.

22. The method of claim 1 , wherein no heat is added to the bonding material during formation of each of the plies.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jul 11, 2013
From: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
To: U.S. DEPARTMENT OF ENERGY
Reel/Frame 030783/0866 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2009
From: WEISBERG, ANDREW H.
To: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (LLNS)
Reel/Frame 023621/0353 →
Continuity (1)
Related Publication 20110104471A1 · May 5, 2011