Camera module and method of manufacturing the camera module
A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.
1. A camera module, comprising:
an image sensor chip including a substrate having first and second opposite surfaces, and a ground pad on the first surface;
a housing extending around the sides of the image sensor chip, and wherein the first surface of the substrate bearing the ground pad faces the interior of the housing and the second surface is exposed to the environment outside the housing;
an electromagnetic wave-shielding film united with the housing;
an optical unit disposed in the housing and having an optical axis intersecting the image sensor chip;
an electrical conductor extending through a side of the housing and electrically connecting the ground pad and the electromagnetic wave-shielding film; and
a transparent member disposed on the first surface of the image sensor chip so as to cover the image sensor chip, and
wherein the transparent member has a recess into which the conductor extends and in which the conductor is connected to the ground pad.
2. A camera module, comprising:
an image sensor chip including a substrate having first and second opposite surfaces, and a ground pad on the first surface;
a housing extending around the sides of the image sensor chip, and wherein the first surface of the substrate bearing the ground pad faces the interior of the housing and the second surface is exposed to the environment outside the housing, and wherein the housing has a through-hole extending through a side thereof;
an electromagnetic wave-shielding film extending on a surface of the housing, which defines the through-hole, as united with the housing;
an optical unit disposed in the housing and having an optical axis intersecting the image sensor chip; and
an electrical conductor extending in said through-hole through the side of the housing and electrically connecting the ground pad and the electromagnetic wave-shielding film.
3. The camera module of claim 2 , wherein the ground pad is disposed at an outer peripheral portion of the image sensor chip.
4. The camera module of claim 2 , wherein the image sensor chip includes a plurality of chip pads on the first surface.
5. The camera module of claim 4 , wherein the image sensor chip includes electrically conductive vias that extend through the substrate of the image sensor chip and are electrically connected to the chip pads.
6. The camera module of claim 5 , wherein the image sensor chip includes a plurality of outer connection pads disposed on the second surface of the substrate and electrically connected to the vias.
7. The camera module of claim 2 , wherein the image sensor chip includes an image sensor exposed at the first surface of the substrate and comprising electronic circuitry, and pads of electrically conductive material disposed on the first surface of the substrate, the pads connected to the circuitry of the image sensor and including the ground pad.
8. The camera module of claim 7 , wherein the image sensor is a complementary metal oxide silicon (CMOS) image sensor comprising an active region of pixels and a logic device including a plurality of CMOS transistors that process signals output from the pixels.
9. The camera module of claim 7 , further comprising an electromagnetic wave-shielding film united with the housing and circumscribing substantially the entirety of a region within the housing that contains the circuitry of the chip.
10. The camera module of claim 9 , wherein the pads connected to the circuitry of the image sensor include chip pads, and the chip includes electrically conductive vias that extend through the substrate of the image sensor chip and are electrically connected to the chip pads.
11. The camera module of claim 10 , wherein the conductor contacts the electromagnetic wave-shielding film.
12. The camera module of claim 7 , wherein the pads connected to the circuitry of the image sensor include chip pads, and the chip includes electrically conductive vias that extend through the substrate of the image sensor chip and are electrically connected to the chip pads.
13. The camera module of claim 2 , further comprising a transparent member disposed on the first surface of the image sensor chip so as to cover the image sensor chip.
14. The camera module of claim 2 , wherein the ground pad is embedded in the conductor.