IP Library Granted Patent US 8,547,766
Granted Patent B2
US 8,547,766 · App. 12/659,883 · Granted Oct 1, 2013

Area-efficient data line layouts to suppress the degradation of electrical characteristics

Inventors: Jong-Hak Won (Hwaseong-si, KR); Hyang-Ja Yang (Suwon-si, KR); Choong-Sun Shin (Seongnam-si, KR); Hak-Soo Yu (Seongnam-si, KR); Young-Soo An (Yongin-si, KR); Jung-Hyeon Kim (Hwaseong-si, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,547,766
App. No.
12/659,883
Granted
Oct 1, 2013
Kind
B2
Abstract

A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.

Claims (30)

1. A data line layout, comprising:

a column selection line arranged in a first direction in a layer; and

a data bus line arranged in the first direction in the layer, the data bus line connected to a global I/O sense amplifier and an I/O pad, and the data bus line arranged on a cell array region, wherein a set of the column selection line and the data bus line are in parallel with each other and horizontally interposed between a pair of a bit line and a complementary bit line, and the set of the column selection line and the data bus line are formed in a first layer and the pair of bit lines is formed in a second layer.

2. The layout of claim 1 , wherein the column selection line is shared by more than two local I/O lines.

3. The layout of claim 1 , wherein the data bus line is a plurality of data bus lines,

the global I/O sense amplifier is a plurality of global I/O sense amplifiers, and

the global I/O sense amplifier is configured to be connected to a local I/O sense amplifier.

4. The layout of claim 3 , wherein the data bus lines are arranged between the global I/O sense amplifier and the I/O pad.

5. The layout of claim 3 , further comprising:

a global I/O line arranged in the first direction in the layer, the global I/O line connected between the local I/O sense amplifier and the global I/O sense amplifier.

6. The layout of claim 3 , further comprising:

a local I/O line arranged in a second direction intersecting the first direction and connected between the local I/O sense amplifier and a bit line sense amplifier,

wherein the bit line sense amplifier is connected to the bit line, the bit line crossing the cell array region.

7. The layout of claim 6 , wherein the bit line is arranged in the first direction.

8. The layout of claim 6 , wherein the local I/O line is configured to be switched in response to a column selection signal applied to the column selection line.

9. The layout of claim 8 , further comprising a global I/O line arranged in the first direction in the layer,

wherein the local I/O line is arranged in a different layer than the layer including the data bus line, the column selection line and the global I/O line.

10. The layout of claim 1 , further comprising:

a global I/O line arranged in the first direction in the layer,

wherein the layer is in the cell array region.

11. The layout of claim 10 , further comprising:

a local I/O line arranged in a second direction intersecting the first direction.

12. The layout of claim 11 , further comprising:

a word line selection line arranged in the second direction intersecting the first direction;

the bit line arranged in the first direction; and

a word line arranged in the second direction.

13. The layout of claim 1 , wherein the data bus line is less than about 14500 μm in length.

14. A semiconductor memory device configured according to the layout of claim 1 .

15. An electronic system comprising a semiconductor device configured according to the layout of claim 1 .

16. The layout of claim 1 , wherein the set further comprises a global I/O line in the first layer, the global I/O line connected between a local I/O sense amplifier and the global I/O sense amplifier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2010
From: WON, JONG-HAK; YANG, HYANG-JA; SHIN, CHOONG-SUN; YU, HAK-SOO; AN, YOUNG-SOO; KIM, JUNG-HYEON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 024190/0676 →
Priority Claims (1)
KR 10-2009-0031021 · Apr 9, 2009 · national
Continuity (1)
Related Publication 20100259963A1 · Oct 14, 2010