IP Library › Granted Patent US 8,550,766
Granted Patent B2
US 8,550,766 · App. 12/819,300 · Granted Oct 8, 2013

Method and device for aligning components

Inventors: Pascal Dromard (Montlebon, FR); Sébastien Maier (St. Aubin-Sauges, CH)
Assignee: Ismeca Semiconductor Holdings SA
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Quick Facts
Patent No.
US 8,550,766
App. No.
12/819,300
Granted
Oct 8, 2013
Kind
B2
Abstract

Method and apparatus for aligning a small-size component with vacuum pick-up nozzles within turrets used with electronic components or assembly equipments. The method comprises the steps of picking-up the component with a pick-up nozzle; measuring a position of the component in respect to a defined value; bringing the component held by the pick-up nozzle in contact with a aligning device; holding the component with the aligning device and; moving the aligning device in order to align the component based on the position measurement.

Claims (27)

1. An aligning method comprising the steps of:

(a) picking-up a component with a pick-up nozzle by applying a negative pressure on the pick-up nozzle;

(b) measuring a position of the component in respect to defined position values;

wherein,

(c) bringing the component held by the pick-up nozzle in contact with an aligning device;

(d) holding the component with the aligning device; and

(e) moving the aligning device, based on the position measurement in step (b), in the x-direction and/or y-direction perpendicular to a plane of the aligning device, and along an angular orientation relative to a rotation axis of the aligning device and/or along an angular orientation relative to a plane perpendicular to the aligning device, in order to align the component.

2. The aligning method according to claim 1 , wherein said position is measured with a camera.

3. The aligning method according to claim 1 , wherein the aligning comprises linear displacement along two orthogonal directions in a plane.

4. The aligning method according to claim 1 , wherein the aligning comprises at least one rotation relative to a rotation axis.

5. The aligning method according to claim 1 , wherein bringing said pick-up nozzle and said aligning device in contact with opposing surfaces of the component.

6. The aligning method according to claim 1 , wherein moving the component while it is in contact with both pick-up nozzle and the aligning device.

7. The aligning method according to claim 1 , wherein said component is moved by said a aligning device without any contact between said aligning device and the lateral faces of said component.

8. The aligning method according to claim 6 , said aligning device being an aligning nozzle, wherein said component is held by applying a negative pressure to the aligning nozzle when it is moved, wherein, after completion of the alignment, the component is held by applying a negative pressure to the pick-up nozzle and subsequently releasing the negative pressure from the aligning nozzle.

9. The aligning method according to claim 8 , wherein the component remains held by the pick-up nozzle by applying a negative pressure to the pick-up nozzle, while the component is moved by the aligning nozzle.

10. The aligning method according to claim 8 , wherein by applying a zero or positive pressure to the aligning nozzle or pick-up nozzle and subsequently releasing the negative pressure on the pick-up nozzle or aligning nozzle respectively in order to pass the holding control of the component between the two nozzles.

11. A component handling device for performing a method according to claim 1 , the device comprising:

a pick-up nozzle capable of holding and transporting a component and connected to a source of negative pressure;

means for measuring a position of the component in respect to defined position values;

wherein,

an aligning device configured to hold the component; and

an actuator for moving the aligning device based on the position measurement, in the x-direction and/or y-direction perpendicular to a plane of the aligning device, and along an angular orientation relative to a rotation axis of the aligning device and/or along an angular orientation relative to a plane perpendicular to the aligning device, in order to align the component.

12. A component handling device according to claim 11 , wherein said actuator is adapted to move linearly the aligning device along two orthogonal directions in a plane.

13. A component handling device according to claim 11 , wherein said actuator is adapted to rotate the aligning device relative to at least one rotation axis.

14. A component handling device according to claim 11 , wherein a camera unit for capturing an image of the component while held on the pick-up nozzle as means for measuring a position of the component.

15. A component handling device according to claim 11 , wherein the aligning device is an aligning nozzle connected to a negative pressure source.

16. A component handling device according to claim 11 , wherein the aligning device is a pin, a disc, or a socket as aligning device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2010
From: DROMARD, PASCAL; MAIER, SEBASTIEN
To: ISMECA SEMICONDUCTOR HOLDINGS SA
Reel/Frame 024566/0058 →
Priority Claims (1)
EP 07150412 · Dec 24, 2007 · regional
Continuity (2)
Continuation PCTEP2008067752 · Dec 17, 2008
Related Publication 20100254788A1 · Oct 7, 2010