IP Library › Granted Patent US 8,552,306
Granted Patent B2
US 8,552,306 · App. 12/671,153 · Granted Oct 8, 2013

Assembly and production of an assembly

Inventors: Daniel Wolde-Giorgis (Leinfelden-Echterdingen, DE); Thomas Kalich (Lichtenstein, DE)
Assignee: Robert Bosch GmbH
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Quick Facts
Patent No.
US 8,552,306
App. No.
12/671,153
Granted
Oct 8, 2013
Kind
B2
Abstract

An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.

Claims (13)

1. An assembly comprising:

a substrate;

at least one component;

a first metallic strip conductor affixed to a first side of the substrate and having a recess with (i) an uniquely contoured outline corresponding to a contour of the at least one component such that the at least one component has a single orientation in the recess in which the at least one component cannot be shifted and (ii) a depth that accommodates at least some areas of the at least one component; and

a second metallic strip conductor affixed to a second side of the substrate opposite the first side;

wherein the at least one component is fastened on the first metallic strip conductor in the recess by sintering using a sintering agent, the sintering agent and the at least one component being situated in the recess.

2. The assembly according to claim 1 , wherein the sintering agent includes sintering paste.

3. The assembly according to claim 1 , wherein the recess has an outline that corresponds substantially to a contour of the component.

4. The assembly according to claim 1 , wherein the sintering agent is a silver sintering paste or a solid sintering agent.

5. The assembly according to claim 1 , wherein the component is an electrical/electronic component, including a power semiconductor.

6. The assembly according to claim 1 , wherein the substrate is a pressed screen or a circuit board.

7. The assembly of claim 1 , wherein the recess of the substrate has at least one bulge at a corner of the recess containing an excess of the sintering agent situated in the recess.

8. The assembly of claim 7 , wherein the recess of the substrate has a bulge at each corner of the recess containing the excess sintering agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2010
From: WOLDE-GIORGIS, DANIEL; KALICH, THOMAS
To: ROBERT BOSCH GMBH
Reel/Frame 024510/0524 →
Priority Claims (1)
DE 10 2007 037 538 · Aug 9, 2007 · national
Continuity (1)
Related Publication 20100252312A1 · Oct 7, 2010