Power semiconductor device
A semiconductor layer has a first layer of first conductive type, a second layer of second conductive type, and a third layer. The third layer has a first region of first conductive type, and a second region of second conductive type. A second electrode is in contact with each of the first and second regions. A trench is formed on the semiconductor layer at a surface opposite to its surface facing a first electrode. A gate electrode is embedded in the trench with a gate insulating film interposed therebetween. The gate electrode includes a first portion projecting into the first layer through the first region and the second layer, a second portion projecting into the first layer through the second region and the second layer. The second portion projects into the first layer deeper than a depth in which the first portion projects into the first layer.
1. A power semiconductor device, comprising:
a first electrode; and
a semiconductor layer provided on said first electrode, a trench being formed on said semiconductor layer at a surface opposite to a surface facing said first electrode,
said semiconductor layer including
a first layer of a first conductive type, provided on said first electrode,
a second layer of a second conductive type which is different from the first conductive type, provided on said first layer, and
a third layer provided on said second layer and having a first region of said first conductive type and a second region of said second conductive type,
the power semiconductor device further comprising:
a second electrode in contact with each of said first and second regions;
a gate insulating film covering an inner wall of said trench; and
a gate electrode embedded in said trench with said gate insulating film interposed therebetween,
said gate electrode including a first portion projecting into said first layer through said first region and said second layer, and a second portion projecting into said first layer through said second region and said second layer,
said second portion projecting into said first layer deeper than a depth in which said first portion projects into said first layer.
2. The power semiconductor device according to claim 1 , wherein in said trench, a portion in which said second portion of said gate electrode is embedded has a width wider than that of a portion in which said first portion of said gate electrode is embedded.
3. The power semiconductor device according to claim 1 , wherein said semiconductor layer includes a fourth layer of said second conductive type between said first electrode and said first layer.