IP Library › Granted Patent US 8,558,272
Granted Patent B2
US 8,558,272 · App. 13/184,320 · Granted Oct 15, 2013

Illumination apparatus having a plurality of semiconductor light-emitting devices

Inventors: Tomohiro Sanpei (Yokosuka, JP); Masahiro Izumi (Fujisawa, JP); Shinji Nogi (Tokyo, JP); Akiko Saito (Yokohama, JP)
Assignee: Toshiba Lighting & Technology Corporation
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Quick Facts
Patent No.
US 8,558,272
App. No.
13/184,320
Granted
Oct 15, 2013
Kind
B2
Abstract

An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

Claims (18)

1. An illumination apparatus comprising:

a flat board comprising a flat light reflective surface;

a plurality of light-emitting elements arranged in intervals on the flat light reflective surface, each of the light-emitting elements comprising a translucent substrate and a light emitting layer formed on the substrate, the substrates being directly bonded to the flat light reflective surface by translucent adhesive layers, and the light-emitting layers being thinner than the substrates;

a wiring layer disposed on the flat board, the wiring layer being thinner than the substrates of the light-emitting elements;

a single frame disposed on the flat board, the single frame surrounding all of the plurality of light-emitting elements and the wiring layer; and

a sealing member disposed in a single region surrounded by the single frame, the sealing member formed of a material having a light-transmitting property and covering all of the plurality of light-emitting elements, the wiring member, and the flat light reflective surface;

wherein the substrates of the light-emitting elements and the light-emitting layers protrude at a position higher than the wiring layer.

2. The illumination apparatus of claim 1 , wherein the light-emitting elements are electrically connected to the wiring layer on the flat light reflective surface.

3. The illumination apparatus of claim 1 , wherein the single frame comprises a light reflective surface facing the single region in which the sealing member is disposed.

4. An illumination apparatus comprising:

a flat board;

a reflective layer disposed on the flat board, the reflective layer comprising a flat light reflective surface;

a plurality of light-emitting elements, each of the plurality of light-emitting elements comprising a translucent substrate and a light-emitting layer, the substrate including a first surface and a second surface positioned on a reverse side of the first surface, the second surfaces of the translucent substrates being directly bonded to the flat light reflective surface by translucent adhesive layers, and the light-emitting layers being formed on the first surfaces and being thinner than the substrates;

a wiring layer being provided on the flat board, the wiring layer being thinner than the substrates of the light-emitting elements;

a single frame disposed on the reflective layer, the single frame surrounding all of the plurality of light-emitting elements and the wiring layer; and

a sealing member disposed in a single a region surrounded by the single frame, the sealing member formed of a material having a light-transmitting property and covering all of the plurality of light-emitting elements, the wiring layer, and the flat light reflective surface;

wherein the first surfaces of the substrates of the light-emitting elements protrude at a position higher than the wiring layer.

5. The illumination apparatus of claim 4 , wherein the wiring layer is electrically connected to the light-emitting elements.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2011
From: SANPEI, TOMOHIRO; IZUMI, MASAHIRO; NOGI, SHINJI; SAITO, AKIKO
To: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
Reel/Frame 026634/0275 →
Priority Claims (1)
JP 2006-232634 · Aug 29, 2006 · national
Continuity (2)
Continuation 11844037 · Aug 23, 2007
Related Publication 20110273880A1 · Nov 10, 2011