Method and device for processing a movable substrate by means of laser
The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.
1. Device for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein the device comprises: guide means for guiding the substrate; laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone; and a pump for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate; wherein the guide means comprise two parallel extending guide means adapted to subject the substrate to at least one curvature, the guide means comprising an air bearing comprising two boxes with a curved guide surface in which perforations are arranged, the interior of the boxes being connected with the pump, wherein the laser processing means are situated at least partially between the two parallel extending guide means.
2. Device as claimed in claim 1 , wherein the guide means further comprise at least one rotatable cylinder with pressing or suction means for urging the substrate against the rotatable cylinder or the guide means further comprise at least one air bearing with a curved guide surface.
3. Device as claimed in claim 2 , wherein the pressing means comprise at least one drive belt, wherein each drive belt is adapted to press the substrate against one of the air bearings or cylinder.
4. Device as claimed in claim 3 , wherein the guide means are adapted to subject the substrate to a curvature in the laser operation zone or after the substrate has been processed with laser.
5. Device as claimed in claim 4 , wherein the guide means are adapted to direct the concave side of the substrate toward the laser beam.
6. Device as claimed in claim 5 , wherein the guide means are adapted to force the substrate into a curvature in the form of a circular arc, and the axis of rotation of a deflecting mirror, which is adapted to deflect the laser beam in the plane of the curvature of the substrate, is situated in the centre of the circular arc.
7. Device as claimed in claim 5 , wherein the laser is adapted to process the substrate within an elongate operation zone, and the axis of the curvature extends transversely of the largest dimension of the operation zone.
8. Device as claimed in claim 7 , wherein the axis of the curvature extends transversely of the direction of movement of the substrate.
9. Device as claimed in claim 2 , wherein the guide means are adapted to subject the substrate to a curvature in the laser operation zone or after the substrate has been processed with laser.
10. Device as claimed in claim 9 , wherein the guide means are adapted to direct the concave side of the substrate toward the laser beam.
11. Device as claimed in claim 10 , wherein the guide means are adapted to force the substrate into a curvature in the form of a circular arc, and the axis of rotation of a deflecting mirror, which is adapted to deflect the laser beam in the plane of the curvature of the substrate, is situated in the centre of the circular arc.
12. Device as claimed in claim 10 , wherein the laser is adapted to process the substrate within an elongate operation zone, and the axis of the curvature extends transversely of the largest dimension of the operation zone.
13. Device as claimed in claim 12 , wherein the axis of the curvature extends transversely of the direction of movement of the substrate.
14. Device as claimed in claim 1 , wherein the guide means are adapted to subject the substrate to a curvature in the laser operation zone or after the substrate has been processed with laser.
15. Device as claimed in claim 14 , wherein the guide means are adapted to direct the concave side of the substrate toward the laser beam.
16. Device as claimed in claim 15 , wherein the guide means are adapted to force the substrate into a curvature in the form of a circular arc, and the axis of rotation of a deflecting mirror, which is adapted to deflect the laser beam in the plane of the curvature of the substrate, is situated in the centre of the circular arc.
17. Device as claimed in claim 15 , wherein the laser is adapted to process the substrate within an elongate operation zone, and the axis of the curvature extends transversely of the largest dimension of the operation zone.
18. Device as claimed in claim 17 , wherein the axis of the curvature extends transversely of the direction of movement of the substrate.