IP Library › Granted Patent US 8,564,383
Granted Patent B2
US 8,564,383 · App. 12/961,609 · Granted Oct 22, 2013

Signal converter and high-frequency circuit module

Inventors: Toshihiro Shimura (Kawasaki, JP); Yoji Ohashi (Kawasaki, JP)
Assignee: Fujitsu Limited
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,564,383
App. No.
12/961,609
Granted
Oct 22, 2013
Kind
B2
Abstract

A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide.

Claims (52)

1. A signal converter, comprising:

a dielectric substrate;

a first conductor layer disposed on one of opposite sides of the dielectric substrate, the first conductor layer including an input section, the input section configured to receive high-frequency signals inputted thereto;

a second conductor layer disposed on the other of the opposite sides of the dielectric substrate;

a plurality of first conducting sections penetrating the dielectric substrate for electrically connecting the first conductor layer and the second conductor layer, the first conducting sections forming a waveguide in the inside of the dielectric substrate together with the first conductor layer and the second conductor layer,

wherein the first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate, the separator section including first and second sections extended from the input section towards the waveguide, the first and second sections separated from each other for gradually increasing an interval between the first and second sections in proportion to a distance away from the input section towards the waveguide.

2. The signal converter recited in one of claims 1 , wherein a length obtained by orthographically projecting the separator section onto the hypothetical axis is greater than or equal to λ/4 and simultaneously less than or equal to 3λ/4, where wavelengths of the high-frequency signals are respectively set to be λ.

3. The signal converter recited in one of claims 1 , wherein a width of the waveguide satisfies the following formula (1), where a width of the waveguide in a direction perpendicular to the propagation direction is set to be d and a permittivity of the dielectric substrate is set to be ∈ r

d

<

λ

0

2

⁢

ɛ

r

(

1

)

4. A high-frequency circuit module, comprising;

the signal converter recited in one of claims 1 ; and

a circuit chip configured to generate high-frequency signals,

wherein the circuit chip includes: a signal line configured to transmit the high-frequency signals; and a metal bump disposed on the signal line, the metal bump electrically connected to the input section of the signal converter.

5. The signal converter recited in claim 1 , wherein a width of the separator section in a direction perpendicular to a propagation direction of the high-frequency signals is less than a width of an area of the first conductor layer disposed outwards of the separator section with respect to a hypothetical axis extended from the input section towards the waveguide along the propagation direction of the high-frequency signals.

6. The signal converter recited in one of claims 5 , wherein a length obtained by orthographically projecting the separator section onto the hypothetical axis is greater than or equal to λ/4 and simultaneously less than or equal to 3λ/4, where wavelengths of the high-frequency signals are respectively set to be λ.

7. The signal converter recited in one of claims 5 , wherein a width of the waveguide satisfies the following formula (1), where a width of the waveguide in a direction perpendicular to the propagation direction is set to be d and a permittivity of the dielectric substrate is set to be ∈ r

d

<

λ

0

2

⁢

ɛ

r

(

1

)

8. The signal converter recited in claim 5 , further comprising:

a second conducting section penetrating the dielectric substrate for electrically connecting the area of the first conductor layer formed outwards of the separator section with respect to the hypothetical axis extended along the propagation direction of the high-frequency signals and an area of the second conductor layer formed outwards of the separator section with respect to the hypothetical axis extended along the propagation direction of the high-frequency signals.

9. The signal converter recited in one of claims 8 , wherein a length obtained by orthographically projecting the separator section onto the hypothetical axis is greater than or equal to λ/4 and simultaneously less than or equal to 3λ/4, where wavelengths of the high-frequency signals are respectively set to be λ.

10. The signal converter recited in one of claims 8 , wherein a width of the waveguide satisfies the following formula (1), where a width of the waveguide in a direction perpendicular to the propagation direction is set to be d and a permittivity of the dielectric substrate is set to be ∈ r

d

<

λ

0

2

⁢

ɛ

r

(

1

)

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2011
From: SHIMURA, TOSHIHIRO; OHASHI, YOJI
To: FUJITSU LIMITED
Reel/Frame 025673/0433 →
Priority Claims (1)
JP 2009-282796 · Dec 14, 2009 · national
Continuity (1)
Related Publication 20110140801A1 · Jun 16, 2011