Ceramic electronic component and method for manufacturing the same
A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
1. A ceramic electronic component comprising:
a ceramic element assembly; and
an external electrode disposed on the ceramic element assembly; wherein
the external electrode includes an underlying electrode layer disposed on the ceramic element assembly and a first Cu plating film disposed on the underlying electrode layer;
the underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material; and
the metal that is diffusible in Cu is diffused into the first Cu plating film.
2. The ceramic electronic component according to claim 1 , wherein grain boundaries are present in the first Cu plating film, and the metal that is diffusible in Cu is diffused along the grain boundaries of the first Cu plating film.
3. The ceramic electronic component according to claim 1 , wherein the metal that is diffusible in Cu is diffused into the first Cu plating film so as to extend to a surface of the first Cu plating film opposite to a surface of the first Cu plating film that is adjacent to the underlying electrode layer.
4. The ceramic electronic component according to claim 1 , wherein the metal that is diffusible in Cu is at least one metal selected from the group consisting of Ni, Ag, Pd, and Au.
5. The ceramic electronic component according to claim 1 , wherein the external electrode further comprises a second Cu plating film disposed on the first Cu plating film, and the metal that is diffusible in Cu is not diffused in the second Cu plating film.
6. The ceramic electronic component according to claim 1 , wherein Cu is diffused in the underlying electrode layer from the first Cu plating film.