IP Library › Granted Patent US 8,567,093
Granted Patent B2
US 8,567,093 · App. 13/013,052 · Granted Oct 29, 2013

Midfoot structure of a sole assembly for a shoe

Inventor: Natsuki Sato (Kawanishi, JP)
Assignee: Mizuno Corporation
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Quick Facts
Patent No.
US 8,567,093
App. No.
13/013,052
Granted
Oct 29, 2013
Kind
B2
Abstract

A midsole structure of a sole assembly for a shoe improves a ride feeling and stability of the midfoot portion of the sole assembly during running. The sole assembly 1 ′ of the shoe includes an upper plate 3 formed of a hard elastic member disposed on an upper side of a midfoot region M, a lower midsole 15 formed of a soft elastic member disposed under the upper plate 3 at the midfoot region, wherein the lower midsole has a downwardly convexedly curved upper surface that forms a void S relative to the upper plate and contacts the upper plate at the front and rear ends of the midfoot portion, and an outsole. The outsole includes a midfoot outsole 6 with a ground contact surface arranged below the lower midsole at the midfoot region, a heel outsole 5 of a heel region H, and a forefoot outsole 7 of a forefoot region F, wherein these outsole members are all discrete and separate from one another in the longitudinal direction.

Claims (12)

1. A sole assembly for a shoe including a midfoot structure comprising:

an upper plate disposed on an upper side of a midfoot portion of the sole assembly and formed of a hard elastic member, wherein the midfoot portion is located in a region corresponding to a plantar arch of a foot of a person wearing the shoe;

a lower midsole disposed below the upper plate at the midfoot portion, formed of a soft elastic member, having a downwardly convexedly curved upper surface to form a void with the upper plate, wherein the lower midsole is located below the void at the midfoot portion; and

a midfoot outsole with a ground contact surface, wherein the midfoot outsole is attached on a lower surface of the lower midsole and located below the lower midsole at the midfoot portion, and is disposed discretely in a longitudinal direction from a heel outsole provided on a heel portion and a forefoot outsole provided on a forefoot portion of the sole assembly.

2. The sole assembly according to claim 1 , further comprising a lower plate of a hard elastic member that is provided on the upper surface of the lower midsole, and that has a downwardly convexedly curved shape to bound the void between the upper plate and the lower plate.

3. The sole assembly according to claim 2 , wherein the upper plate has a hardness greater than that of the lower plate.

4. The sole assembly according to claim 1 , wherein the upper plate extends longitudinally in the longitudinal direction in a generally flat shape or an upwardly convexedly curved shape at the midfoot portion.

5. The sole assembly according to claim 1 , wherein the upper plate has a laterally advancing wavy shape with longitudinal ridge lines extending along the longitudinal direction.

6. The sole assembly according to claim 1 , further comprising an upper midsole of a soft elastic member attached on an upper surface of the upper plate.

7. The sole assembly according to claim 1 , wherein the midfoot portion is disposed in the region which is defined by 0.35L to 0.55L, measuring from a heel rear end edge of the sole assembly, where L is an entire length of the sole assembly.

8. The sole assembly according to claim 7 , wherein a rear end of the midfoot portion is disposed at a position defined by 0.35L to 0.45L, measuring from the heel rear end edge of the sole assembly, and a front end of the midfoot portion is disposed at a position defined by 0.45L to 0.55L, measuring from the heel rear end edge of the sole assembly.

9. The sole assembly according to claim 1 , wherein the lower midsole extends continuously along the forefoot portion, the midfoot portion and the heel portion in the longitudinal direction.

Priority Claims (1)
JP 2006-232920 · Aug 30, 2006 · national
Continuity (2)
Division 11825394 · Jul 6, 2007
Related Publication 20110113656A1 · May 19, 2011