IP Library Granted Patent US 8,580,374
Granted Patent B2
US 8,580,374 · App. 13/534,473 · Granted Nov 12, 2013

Resin molded body

Inventors: Shigeo Hara (Hamamatsu, JP); Takahiko Yamanaka (Hamamatsu, JP)
Assignee: Hamamatsu Photonics K.K.
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Quick Facts
Patent No.
US 8,580,374
App. No.
13/534,473
Granted
Nov 12, 2013
Kind
B2
Abstract

A resin molded body comprises a front surface layer disposed on a front surface side, a back surface layer disposed on a back surface side, and an intermediate layer disposed between the front surface layer and the back surface layer, each of the layers has a micro-phase separated structure including lamellar micro domains, each of the micro domains of the layers has a wave-like shape having amplitudes in the opposite direction of the front surface and the back surface, a maximum value of predetermined distances in the micro domains of the front surface layer and a maximum value of predetermined distances in the micro domains of the back surface layer are larger than the wavelength in the visible light range, and predetermined distances in the micro domains of the intermediate layer are equal to or less than the wavelength in the visible light range.

Claims (39)

1. A resin molded body having a first principal surface and a second principal surface opposed to each other, wherein

the resin molded body comprises a first resin layer containing a block copolymer,

the first resin layer has a micro-phase separated structure including lamellar micro domains,

each of the micro domains of the first resin layer has a wave-like shape having amplitudes in an opposite direction of the first principal surface and the second principal surface, and

in each of the micro domains of the first resin layer, a maximum value of distances in the opposite direction between tops of convexities and bottoms of concavities of the micro domain is larger than a wavelength in a visible light range.

2. The resin molded body according to claim 1 , wherein

the resin molded body further comprises a second resin layer and a third resin layer that contain a block copolymer,

the first resin layer is disposed on a side of the first principal surface,

the second resin layer is disposed on a side of the second principal surface and has a micro-phase separated structure including lamellar micro domains,

the third resin layer is disposed between the first resin layer and the second resin layer and has a micro-phase separated structure including lamellar micro domains,

each of the micro domains of the second resin layer and the third resin layer has a wave-like shape having amplitudes in the opposite direction,

in each of the micro domains of the second resin layer, a maximum value of distances in the opposite direction between tops of convexities and bottoms of concavities of the micro domain is larger than a wavelength in a visible light range, and

in each of the micro domains of the third resin layer, distances in the opposite direction between tops of convexities and bottoms of concavities of the micro domain are equal to or less than a wavelength in a visible light range.

3. The resin molded body according to claim 1 , wherein

the resin molded body further comprises a second resin layer and a third resin layer that contain a block copolymer,

the first resin layer is disposed on a side of the first principal surface,

the second resin layer is disposed on a side of the second principal surface and has a micro-phase separated structure including lamellar micro domains,

the third resin layer is disposed between the first resin layer and the second resin layer and has a micro-phase separated structure including lamellar micro domains,

each of the micro domains of the second resin layer has a wave-like shape having amplitudes in the opposite direction,

in each of the micro domains of the second resin layer, a maximum value of distances in the opposite direction between tops of convexities and bottoms of concavities of the micro domain is larger than a wavelength in a visible light range, and

each of the micro domains of the third resin layer is oriented substantially parallel to at least one of the first principal surface or the second principal surface.

4. The resin molded body according to claim 1 , wherein

the resin molded body further comprises a second resin layer containing a block copolymer,

the first resin layer is disposed on a side of the first principal surface,

the second resin layer is disposed on a side of the second principal surface and has a micro-phase separated structure including lamellar micro domains,

each of the micro domains of the second resin layer has a wave-like shape having amplitudes in the opposite direction, and

in each of the micro domains of the second resin layer, distances in the opposite direction between tops of convexities and bottoms of concavities of the micro domain are equal to or less than a wavelength in a visible light range.

5. The resin molded body according to claim 1 , wherein

the resin molded body further comprises a second resin layer containing a block copolymer,

the first resin layer is disposed on a side of the first principal surface,

the second resin layer is disposed on a side of the second principal surface and has a micro-phase separated structure including lamellar micro domains, and

each of the micro domains of the second resin layer is oriented substantially parallel to at least one of the first principal surface or the second principal surface.

6. The resin molded body according to claim 1 , wherein the resin molded body is composed of the first resin layer.

7. The resin molded body according to claim 1 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

8. The resin molded body according to claim 2 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

9. The resin molded body according to claim 3 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

10. The resin molded body according to claim 4 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

11. The resin molded body according to claim 5 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

12. The resin molded body according to claim 6 , wherein a thickness in the opposite direction of the resin molded body is more than 1000 μm and not more than 3000 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2012
From: HARA, SHIGEO; YAMANAKA, TAKAHIKO
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 028827/0105 →
Priority Claims (1)
JP P2011-145586 · Jun 30, 2011 · national
Continuity (1)
Related Publication 20130004722A1 · Jan 3, 2013