IP Library › Granted Patent US 8,582,796
Granted Patent B2
US 8,582,796 · App. 12/821,868 · Granted Nov 12, 2013

Earmuff and headphone

Inventor: Tominori Kimura (Machida, JP)
Assignee: Kabushiki Kaisha Audio-Technica
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Quick Facts
Patent No.
US 8,582,796
App. No.
12/821,868
Granted
Nov 12, 2013
Kind
B2
Abstract

An earmuff and a headphone includes: a headband; an ear cup attached to the headband; a baffle board fixed on the ear cup; an ear pad engaged to the baffle board. An air-permeable member provided between the baffle board and the ear pad.

Claims (48)

1. An earmuff comprising:

a headband;

an ear cup attached to the headband;

a baffle board which has a first side and is fixed to the ear cup;

an ear pad which has a second side proximate the first side of the baffle board and is engaged to the baffle board; and

an air-permeable member interposed between the first side of the baffle board and the second side of the ear pad,

wherein the baffle board has a ribbed wall which is disposed adjacent the air-permeable member and is interposed between the first side of the baffle board and the second side of the ear pad.

2. The earmuff according to claim 1 , wherein a thickness of the air-permeable member is greater than a thickness of the ear pad.

3. The earmuff according to claim 1 , wherein the air-permeable member is made of a member having a cushioning property.

4. The earmuff according to claim 1 , wherein the air-permeable member is made of a material having a cushioning property which is lower than a cushioning property of the ear pad.

5. The earmuff according to claim 1 , wherein the air-permeable member is made of an air-permeable acoustic absorbing material.

6. The earmuff according to claim 1 , wherein the baffle board has at least one communicating hole that acoustically connects a front air chamber and a rear air chamber.

7. The earmuff according to claim 1 , wherein the baffle board has at least one communicating hole that acoustically connects a front air chamber and a rear air chamber, and

the communicating hole is provided with an acoustic resistor at least on a front air chamber side or a rear air chamber side.

8. The earmuff according to claim 1 , wherein the baffle board is torus-shaped and has a diameter of an inner periphery different from a diameter of an outer periphery.

9. The earmuff according to claim 1 , wherein the ribbed wall is disposed on an outer periphery of the air-permeable member,

a diameter of an inner periphery of the air-permeable member substantially conforms to a diameter of an inner periphery of the baffle board, and

a diameter of an outer periphery of the ribbed wall substantially conforms to a diameter of an outer periphery of the baffle board.

10. The earmuff according to claim 1 , further comprising:

a front air chamber disposed on a side of an ear,

wherein an inner diameter of the air-permeable member defines a cross-sectional dimension of the front air chamber.

11. The earmuff according to claim 1 , wherein the air-permeable member increases a volume of a front air chamber surrounded by the baffle board and the ear pad.

12. A headphone comprising:

a headband;

an ear cup attached to the headband;

a baffle board which has a first side and is fixed to the ear cup;

a speaker unit disposed on the baffle board and configured to output an audible signal;

an ear pad which has a second side proximate the first side of the baffle board and is engaged to the baffle board; and

an air-permeable member interposed between the first side of the baffle board and the second side of the ear pad,

wherein the baffle board has a ribbed wall which is disposed adjacent the air-permeable member and is interposed between the first side of the baffle board and the second side of the ear pad.

13. The headphone according to claim 12 , wherein a thickness of the air-permeable member is greater than a thickness of the ear pad.

14. The headphone according to claim 12 , wherein the air-permeable member is made of a material having a cushioning property.

15. The headphone according to claim 12 , wherein the air-permeable member is made of a material having a cushioning property is lower than a cushioning property of the ear pad.

16. The headphone according to claim 12 , wherein the air-permeable member is made of an air-permeable acoustic absorbing material.

17. The headphone according to claim 12 , wherein the baffle board has at least one communicating hole that acoustically connects a front air chamber and a rear air chamber.

18. The headphone according to claim 12 , wherein the baffle board has at least one communicating hole that acoustically connects the front air chamber and the rear air chamber, and

the communicating hole is provided with an acoustic resistor at least on a front air chamber side or a rear air chamber side.

19. A noise canceling headphone comprising:

a headband;

an ear cup attached to the headband;

a baffle board which has a first side and is fixed to the ear cup;

a speaker unit disposed on the baffle board and configured to output an audible signal;

an ear pad which has a second side proximate the first side of the baffle board and is engaged to the baffle board;

a microphone that is provided on the ear cup or the baffle board and corrects surrounding noise to be converted into an electrical signal;

a canceling signal producing unit that produces a canceling signal that cancels out the electrical signal converted by the microphone;

a combining unit that combines the canceling signal and an audio signal to be output from the speaker unit; and

an air-permeable member interposed between the first side of the baffle board and the second side of the ear pad,

wherein the baffle board has a ribbed wall which is disposed adjacent the air-permeable member and is interposed between the first side of the baffle board and the second side of the ear pad.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2010
From: KIMURA, TOMINORI
To: KABUSHIKI KAISHA AUDIO-TECHNICA
Reel/Frame 024594/0675 →
Priority Claims (1)
JP 2009-159728 · Jul 6, 2009 · national
Continuity (1)
Related Publication 20110002475A1 · Jan 6, 2011