High density multilayer interconnect for print head
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.
1. A method for forming an ink jet print head, comprising:
attaching a plurality of piezoelectric elements to a diaphragm;
forming an interstitial layer directly between adjacent piezoelectric elements, wherein a surface of each piezoelectric element is exposed through the interstitial layer;
forming a plurality of patterned traces on the interstitial layer such that, during the formation of the plurality of traces, the plurality of traces physically contact the interstitial layer and physically and electrically contact the plurality of piezoelectric elements, wherein each trace is electrically coupled to one of the plurality of piezoelectric elements through physical contact with the one of the piezoelectric elements; and
forming a dielectric passivation layer over the plurality of traces.
2. The method of claim 1 , further comprising:
forming a blanket trace layer on the interstitial layer to electrically contact the plurality of piezoelectric elements;
patterning a photosensitive layer over the blanket trace layer; and
etching of the blanket trace layer using the patterned photosensitive layer as a pattern to form the plurality of traces.
3. The method of claim 1 , further comprising:
forming a blanket trace layer; and
performing a laser patterning process to ablate a portion of the blanket trace layer to form the plurality of traces.
4. The method of claim 1 , further comprising:
covering a plurality of openings within the diaphragm with a diaphragm attach material;
attaching a body plate to the diaphragm with the diaphragm attach material; and
during the formation of the interstitial layer, contacting the diaphragm with the interstitial layer, wherein the diaphragm attach material prevents the interstitial layer from passing through the plurality of openings in the diaphragm.
5. The method of cm further comprising:
using a laser beam to ablate a portion of the diaphragm attach material, the interstitial layer, and the passivation layer to clear the plurality of openings within the diaphragm to allow the passage of ink therethrough.
6. The method of claim 5 , further comprising:
using at least one of the diaphragm, the body plate, or an inlet/outlet plate attached to the body plate to mask the laser beam during the ablation which clears the plurality of openings in the diaphragm.
7. The method, of claim further comprising:
establishing electrical contact between the plurality of traces and the plurality of piezoelectric elements through surface contact between the plurality of traces and the plurality of piezoelectric elements.
8. The method of claim 1 , further comprising:
using the interstitial layer as an etch stop during the etching of the blanket trace layer to form the plurality of traces.