IP Library › Granted Patent US 8,585,246
Granted Patent B2
US 8,585,246 · App. 12/863,717 · Granted Nov 19, 2013

Optoelectronic module and projection apparatus comprising the optoelectronic module

Inventors: Kirstin Petersen (Regensburg, DE); Stefan Grötsch (Lengfeld-Bad Abbach, DE); Stephan Miller (Pentling, DE); Günter Spath (Regensburg, DE); Norbert Linder (Lappersdorf, DE); Dominik Eisert (Regensburg, DE); Matthias Peter (Alteglofsheim, DE)
Assignee: OSRAM Optosemiconductors GmbH
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,585,246
App. No.
12/863,717
Granted
Nov 19, 2013
Kind
B2
Abstract

An optoelectronic module for emitting monochromatic radiation in the visible wavelength range is specified. The module has a plurality of light emitting diode chips which generate UV radiation. The UV radiation is converted into light in the visible range, for example, into green light, by a wavelength converter. The coupling-out of light from the module is optimized by the use of two selectively reflecting and transmitting filters. This module can be used as a light source in a projection apparatus.

Claims (25)

1. An optoelectronic module comprising:

a plurality of light emitting diode chips that generate UV radiation;

a wavelength converter disposed downstream of the light emitting diode chips in an emission direction, wherein the wavelength converter converts the UV radiation at least partly into radiation in a visible wavelength range;

at least one common visible filter for the plurality of light emitting diode chips, the common visible filter being disposed downstream of the wavelength converter in the emission direction and having a high transmissivity for the radiation in the visible wavelength range and a high reflectivity for the UV radiation; and

at least one UV filter having a high transmissivity for the UV radiation and a high reflectivity for the radiation in the visible wavelength range, wherein the at least one UV filter is monolithically integrated into one light emitting diode chip or is fixed to at least one radiation-emitting side of the light emitting diode chip.

2. The optoelectronic module as claimed in claim 1 , wherein the at least one UV filter is situated between the wavelength converter and a light emitting diode chip.

3. The optoelectronic module as claimed in claim 1 , wherein the at least one common visible filter is arranged on a radiation-transmissive carrier having a high thermal conductivity.

4. The optoelectronic module as claimed in claim 3 , wherein the wavelength converter is contained in the radiation-transmissive carrier.

5. The optoelectronic module as claimed in claim 1 , wherein at least two light emitting diode chips operate with the wavelength converter.

6. The optoelectronic module as claimed in claim 1 , wherein a filter is spaced apart from the wavelength converter in the emission direction.

7. The optoelectronic module as claimed in claim 6 , further comprising air or a potting compound situated between the filter and the wavelength converter.

8. The optoelectronic module as claimed in claim 1 , wherein the at least one UV filter is monolithically integrated into a light emitting diode chip.

9. An optoelectronic module comprising:

at least three light emitting diode chips;

at least three UV filters, each UV filter transmitting UV radiation and being assigned one-to-one and disposed directly downstream of an associated light emitting diode chip, wherein each light emitting diode chip is monolithically integrated with its associated UV filter;

exactly one wavelength converter disposed downstream of the light emitting diode chips and UV filters; and

exactly one visible filter disposed downstream of the wavelength converter.

10. A projection arrangement comprising a light source, the light source comprising an optoelectronic module as claimed in claim 1 .

11. The projection arrangement as claimed in claim 10 , further comprising a heat-conducting frame, wherein the optoelectronic module is surrounded by the heat-conducting frame.

12. The optoelectronic module as claimed in claim 5 , wherein all light emitting diode chips operate with the wavelength converter.

13. The optoelectronic module as claimed in claim 1 , wherein the wavelength converter comprises one of a plurality of wavelength converters disposed downstream of the light emitting diode chips.

14. The optoelectronic module as claimed in claim 1 , wherein the visible filter transmits at least 75% of the visible radiation impinging on the visible filter and reflects at least 75% of the UV radiation impinging on the visible filter, and wherein the UV filter transmits at least 75% of the UV radiation impinging on the UV filter and reflects at least 75% of the visible radiation impinging on the UV filter.

15. The optoelectronic module as claimed in claim 1 , wherein all of the LEDs have a common wavelength converter and a common UV filter, wherein the common UV filter is disposed downstream of the LEDs in the emission direction and covers the LEDs completely, and wherein the wavelength converter is arranged between the common UV filter and the common visible filter, wherein the common visible filter covers the wavelength converter completely.

16. The optoelectronic module as claimed in claim 1 , wherein the wavelength converter converts the UV radiation into green light having a peak wavelength in the range of 490 nm to 545 nm and the common visible filter is only transmissive for green light in the wavelength range between 490 nm and 545 nm.

17. The optoelectronic module as claimed in claim 1 , wherein the at least one UV filter is fixed to at least one radiation-emitting side of the light emitting diode chip.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE SPELLING OF ASSIGNOR NAMES PREVIOUSLY RECORDED ON REEL 025086 FRAME 0103. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 30, 2013
From: PETERSEN, KIRSTIN; GROETSCH, STEFAN; MILLER, STEPHAN; SPATH, GUENTER; LINDER, NORBERT; EISERT, DOMINIK; PETER, MATTHIAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 030920/0676 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2010
From: PETERSEN, KIRSTIN; GROTSCH, STEFAN; MILLER, STEPHAN; SPATH, GUNTER; LINDER, NORBERT; EISERT, DOMINIK; PETER, MATTHIAS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 025086/0103 →
Priority Claims (2)
DE 10 2008 006 974 · Jan 31, 2008 · national
DE 10 2008 017 071 · Apr 3, 2008 · national
Continuity (1)
Related Publication 20110019411A1 · Jan 27, 2011