Femtosecond laser system for the exact manipulation of material and tissues

1. A device for precise machining of a material, comprising:

a pulsed laser system having a beam source including a cavity-dumped femtosecond oscillator, the beam source being configured to generate radiation having a pulse energy in a range from 100 nJ to 10 μJ and a pulse duration in a range from 100 femtoseconds to 1 picosecond; and

a holding device configured to fix the material in a defined position relative to the beam source such that an output of the cavity-dumped femtosecond oscillator is directed to the material so as to destroy a cohesion of the material using photodisruption.

2. The device as recited in claim 1 , wherein the material is an organic material.

3. The device as recited in claim 1 , further comprising a beam apparatus for at least one of a beam formation, a beam guidance, a beam deflection and a beam focusing.

4. The device as recited in claim 3 , wherein the beam apparatus is programmable.

5. The device as recited in claim 3 , wherein the beam apparatus is configured to apply a working beam of the beam source to the material in a geometrically predeterminable tbrm and in a temporally predeterminable pattern.

6. The device as recited in claim 5 , wherein the beam apparatus includes a beam deflection device and wherein a repetition rate of the working beam is changeable during application of the working beam to the material.

7. The device as recited in claim 1 , wherein the pulse energy is 1 μJ.

8. The device as recited in claim 1 , wherein the cavity dumped femtosecond oscillator is configured to provide laser pulses with repetition rates from 10 kHz to 10 MHz.

9. The device as recited in claim 1 , wherein the material includes an eye of a human patient.

10. The device as recited in claim 1 , wherein the material includes a cornea of a human patient.

11. The device as recited in claim 1 , wherein the beam source is configured to generate radiation having a pulse energy in a range from 500 nJ to 5 μJ.

12. The device as recited in claim 1 , wherein the beam source is configured to generate radiation having a pulse duration in a range from 200 femtoseconds to 300 femtoseconds.

13. A method for applying a laser beam to a material, the method comprising:

providing a laser beam having femtosecond pulses using a beam source including a cavity-dumped femtosecond oscillator, the pulses having an energy in a range from 100 nJ to 10 μJ;

directing the laser beam on the material so as to destroy a cohesion of the material in a focus of the laser beam using photodisruption.

14. The method as recited in claim 13 , wherein the material is an organic material.

15. The method as recited in claim 14 , further comprising performing refractive surgery using the laser beam.

16. The method as recited in claim 13 , further comprising guiding the pulsed laser beam onto the material using a deflection apparatus and modifying a repetition rate of the femtosecond pulses in relation to a spot pattern produced on the material.

17. The method as recited in claim 13 , wherein the material includes an eye of a human patient.

18. The method as recited in claim 13 , wherein the material includes a cornea of a human patient.

19. The method as recited in claim 13 , wherein the pulses have an enemy in a range from 500 nJ to 5 μJ.