Method of manufacturing light-emitting device
A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.
1. A method of manufacturing a light-emitting device, the method comprising:
providing a plate-shaped substrate;
forming a lattice frame comprising a horizontal frame and a vertical frame on a light-emitting element mounting surface of the plate-shaped substrate, the forming of the lattice frame comprising applying an uncured resin on the light-emitting element mounting surface such that a gap is formed in the uncured resin at an intersection of the horizontal frame and the vertical frame, and then curing the uncured resin;
mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface;
sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame; and
cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.
2. The method according to claim 1 , wherein the forming of the lattice frame is conducted such that at least one of the vertical frame and the horizontal frame of the lattice frame is not formed at the intersection between the vertical frame and the horizontal frame so as to prevent the uncured resin from being doubly applied to the intersection.
3. The method according to claim 1 , wherein the forming of the lattice frame is conducted such that both of the vertical frame and the horizontal frame of the lattice frame are not formed at the intersection between the vertical frame and the horizontal frame so as to prevent an uncured resin from being doubly applied to the intersection.
4. The method according to claim 1 , wherein the lattice frame and the sealing material comprise a resin and are simultaneously cured.
5. The method according to claim 3 , wherein the lattice frame and the sealing material comprise a resin and are simultaneously cured.
6. The method according to claim 1 , wherein, after said curing the uncured resin, the gap is filled with a resin.
7. The method according to claim 1 , wherein, after forming the lattice, the gap is filled with a resin.
8. The method according to claim 7 , wherein the lattice frame, the sealing material, and the resin filling the gap each comprise a resin and are simultaneously cured.