IP Library Granted Patent US 8,587,391
Granted Patent B2
US 8,587,391 · App. 12/710,590 · Granted Nov 19, 2013

Acoustic coupling layer for coupled resonator filters and method of fabricating acoustic coupling layer

Inventors: Steve Gilbert (San Francisco, CA); Rick Snyder (Windsor, CO); John D. Larson, III (Palo Alto, CA); Phil Nikkel (Loveland, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 8,587,391
App. No.
12/710,590
Granted
Nov 19, 2013
Kind
B2
Abstract

In accordance with a representative embodiment, a bulk acoustic wave (BAW) resonator structure, comprises: a first BAW resonator comprising a first lower electrode, a first upper electrode and a first piezoelectric layer disposed between the first lower electrode and the first upper electrode; a second BAW resonator comprising a second lower electrode, a second upper electrode and a second piezoelectric layer disposed between the second lower electrode and the second upper electrode; and a single-material acoustic coupling layer disposed between the first and second BAW resonators, the acoustic coupling layer having an acoustic impedance less than approximately 6.0 MRayls and an acoustic attenuation less than approximately 1000 dB/cm.

Claims (20)

1. A bulk acoustic wave (BAW) resonator structure, comprising:

a first BAW resonator comprising a first lower electrode, a first upper electrode and a first piezoelectric layer disposed between the first lower electrode and the first upper electrode;

a second BAW resonator comprising a second lower electrode, a second upper electrode and a second piezoelectric layer disposed between the second lower electrode and the second upper electrode; and

a single-material acoustic coupling layer disposed between the first BAW resonator and the second BAW resonator, the single-material acoustic coupling layer comprising an inhomogeneous acoustic property across a thickness of the acoustic coupling layer, wherein the single-material acoustic coupling layer has an acoustic impedance less than approximately 6.0 MRayls and an acoustic attenuation less than approximately 1000 dB/cm.

2. A BAW resonator structure as claimed in claim 1 , wherein the single-material acoustic coupling layer comprises carbon-doped silicon oxide (SiOCH).

3. A BAW resonator structure as claimed in claim 1 , wherein the single-material acoustic coupling layer comprises one of silicon oxynitride (SiON), boron doped silicate glass (BSG), and phosphosilicate glass (PSG).

4. A BAW resonator structure as claimed in claim 1 , wherein the acoustic impedance is less than approximately 5.0 MRayls and greater than approximately 1.0 MRayls.

5. A BAW resonator structure as claimed in claim 1 , wherein the acoustic attenuation is greater than approximately 10 dB/cm.

6. A BAW resonator structure as claimed in claim 1 , wherein the single-material acoustic coupling layer comprises a single layer.

7. A BAW resonator structure as claimed in claim 1 , further comprising an acoustic coupling structure disposed between the first and second BAW resonators, the acoustic coupling structure comprising:

the single-material acoustic coupling layer; and

another acoustic coupling layer.

8. A BAW resonator structure as claimed in claim 1 , further comprising:

a first adhesion layer disposed between the single-material acoustic coupling layer and the first BAW resonator; and

a second adhesion layer disposed between the single-material acoustic coupling layer and the second BAW resonator.

9. A BAW resonator structure as claimed in claim 8 , wherein the first adhesion layer is silicon-carbide (SiC).

10. A BAW resonator structure as claimed in claim 8 , wherein the second adhesion layer is silicon-carbide (SiC).

11. A BAW resonator structure as claimed in claim 1 , wherein the BAW resonator structure comprises a coupled resonator filter (CRF).

12. A BAW resonator structure as claimed in claim 1 , the acoustic impedance varies by a factor of approximately 2:1 over the thickness of the single-material acoustic coupling layer.

13. A BAW resonator structure as claimed in claim 1 , wherein the acoustic attenuation is greater than approximately 10 dB/cm and less than approximately 1000 dB/cm.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2010
From: GILBERT, STEVE; SNYDER, RICK; LARSON, JOHN D., III; NIKKEL, PHIL
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 023980/0511 →
Continuity (1)
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