Method of manufacturing a metallized ceramic substrate
A method of manufacturing a metallized ceramic substrate includes forming a metal layer on a ceramic substrate, and forming on the metal layer a resist having a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom. A first width of the first patterned resist opening is greater than the thickness of the metal layer, and a second width of the second patterned resist opening is less than the thickness of the metal layer. A wet-etching process is conducted, to form in the first patterned resist opening a patterned metal layer opening and form in the second patterned resist opening a patterned metal layer dent. Therefore, an internal stress between the metal layer and the ceramic substrate is reduced, and the yield rate and reliability of the metallized ceramic substrate is increased.
1. A method of manufacturing a metallized ceramic substrate, including:
forming a metal layer on a ceramic substrate;
forming a resist on the metal layer, wherein the resist has a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom, the first patterned resist opening has a first width greater than a thickness of the metal layer, and the second patterned resist opening has a second width less than the thickness of the metal layer;
conducting a wet-etching process, to form in the first patterned resist opening a patterned metal layer opening for the ceramic substrate to be exposed therefrom and to form in the second patterned resist opening a patterned metal layer dent; and
removing the resist.
2. The method of claim 1 , wherein the first patterned resist opening is in the shape of a checkerboard, and the metal layer, after the conducting of the wet-etching process, becomes a plurality of metal bumps arranged in a matrix.
3. The method of claim 2 , wherein the patterned metal layer dent is located on a periphery of the metal bumps.
4. The method of claim 1 , further comprising removing the metal layer at a top periphery of the patterned metal layer opening or the patterned metal layer dent.
5. The method of claim 4 , wherein the metal layer at the top periphery of the patterned metal layer opening or the patterned metal layer dent is removed by a brushing wheel, a mounted point, sandblasting or electrical discharge machining.
6. The method of claim 5 , wherein the sandblasting machining include:
forming on the metal layer a metal mask that has a metal mask opening for the patterned metal layer opening, the patterned metal layer dent, and peripheries thereof to be exposed therefrom;
conducting a sandblasting process; and
removing the metal mask.
7. The method of claim 4 , wherein the top periphery of the patterned metal layer opening or the patterned metal layer dent is in a curved surface or an inclined plane, or in a shape of steps, after removing the metal layer at the top periphery of the patterned metal layer opening or the patterned metal layer dent.
8. A method of manufacturing a metallized ceramic substrate, including:
forming a metal layer on a ceramic substrate;
forming on the metal layer a resist that has a patterned resist opening for the metal layer to be exposed therefrom;
conducting a wet-etching process, to form in the patterned resist opening a patterned metal layer opening for the ceramic substrate to be exposed therefrom;
removing the resist;
and removing the metal layer at a top periphery of the patterned metal layer opening by.
9. The method of claim 8 , wherein the patterned resist opening is in a shape of a checkerboard, and the metal layer, after the conduction of the wet-etching process, becomes a plurality of metal bumps arranged in a matrix.
10. The method of claim 8 , wherein the sandblasting machining include:
forming on the metal layer a metal mask that has a metal mask opening for the patterned metal layer opening, the patterned metal layer dent, and peripheries thereof to be exposed therefrom;
conducting a sandblasting process; and
removing the metal mask.
11. The method of claim 8 , wherein the top periphery of the patterned metal layer opening is in a curved surface or an inclined plane, or in a shape of steps, after removing the metal layer at the top periphery of the patterned metal layer opening or the patterned metal layer dent.