Organic light emitting device and method for manufacturing the same
An organic light emitting device and a method for manufacturing that same are discussed, which can reduce thickness and weight of the device as well as the manufacturing cost. The organic light emitting device includes according to an embodiment an organic light emitting diode (OLED) formed on a glass substrate; an adhesive layer formed to cover the OLED; and a metal foil formed on the adhesive layer to seal the OLED and bonded to the glass substrate, wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate.
1. An organic light emitting device comprising:
a glass substrate;
an organic light emitting diode (OLED) formed on the glass substrate;
an adhesive layer formed to cover the OLED; and
a metal foil formed on the adhesive layer to seal the OLED, and bonded to the glass substrate,
wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate, and
wherein the metal foil is formed of an alloy in which a content of Ni added to Fe has a composition ratio of approximately 33%˜35% or approximately 38.5%˜41.5%.
2. The organic light emitting device of claim 1 , wherein the metal foil is formed of a Fe—Ni alloy or KOVAR (Fe—Ni—Co alloy).
3. The organic light emitting device of claim 2 , wherein the Fe—Ni alloy includes Fe-36Ni or Fe-42Ni and the KOVAR includes Fe-33Ni-4.5Co.
4. The organic light emitting device of claim 1 , wherein the metal foil has a thermal expansion coefficient of approximately 2.5 [ppm/° C.]˜5.5 [ppm/° C.].
5. The organic light emitting device of claim 1 , wherein the metal foil has a thickness of approximately 50 μm to 500 μm.
6. The organic light emitting device of claim 1 , wherein the adhesive layer is formed of an adhesive film, an optical cleared adhesive (OCA), a thermal hardening resin, or a thermal hardening sealing material, to seal the OLED.
7. A method of forming an organic light emitting device, comprising:
forming a glass substrate;
forming an organic light emitting diode (OLED) on the glass substrate;
forming an adhesive layer to cover the OLED; and
forming a metal foil on the adhesive layer to seal the OLED, the metal foil bonded to the glass substrate,
wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate, and
wherein the metal foil is formed of an alloy in which a content of Ni added to Fe has a composition ration of approximately 33%˜35% or approximately 38.5%˜41.5%.
8. The method of claim 7 , wherein the metal foil is formed of a Fe—Ni alloy or KOVAR (Fe—Ni—Co alloy).
9. The method of claim 7 , wherein the metal foil has a thermal expansion coefficient of approximately 2.5 [ppm/° C.]˜5.5 [ppm/° C.].
10. The method of claim 7 , wherein the metal foil has a thickness of approximately 50 μm to 500 μm.
11. The method of claim 7 , wherein the adhesive layer is formed of an adhesive film, an optical cleared adhesive (OCA), a thermal hardening resin, or a thermal hardening sealing material, to seal the OLED.
12. A method for manufacturing an organic light emitting device, the method comprising:
providing a glass substrate;
forming an organic light emitting diode (OLED) and a plurality of lines and driving devices for driving the OLED on the glass substrate;
depositing a thermal hardening resin or a thermal hardening sealing material on the glass substrate to cover the OLED; and
providing an adhesive layer by aligning a metal foil on the glass substrate and performing a thermal hardening process at a temperature of 80° C.˜120° C. and sealing the OLED by bonding the glass substrate to the metal foil,
wherein the metal foil is formed of an alloy having substantially the same thermal expansion coefficient as that of the glass substrate, and
wherein the metal foil is formed of an alloy in which a content of Ni added to Fe has a composition ratio of approximately 33%˜35% or approximately 38.5%˜41.5%.
13. The method of claim 12 , wherein the metal foil is formed of a Fe—Ni alloy or KOVAR (Fe—Ni—Co alloy).
14. The method of claim 12 , wherein the Fe—Ni alloy includes Fe-36Ni or Fe-42Ni and the KOVAR includes Fe-33Ni-4.5Co.
15. The method of claim 12 , wherein the metal foil is formed of an alloy having a thermal expansion coefficient of approximately 2.5 [ppm/° C.]˜5.5 [ppm/° C.] to have a thickness of approximately 50 μm to 500 μm.
16. The method of claim 12 , wherein the adhesive layer is formed of an adhesive film, an optical cleared adhesive (OCA), a thermal hardening resin, or a thermal hardening sealing material, to seal the OLED.
17. The method of claim 12 , wherein the step of forming the OLED includes:
forming sequentially an anode electrode, a hole injection layer, a light emitting layer, an electron injection layer and a cathode electrode on the glass substrate.