Semiconductor device
A semiconductor device includes: a transistor region including an IGBT having a gate electrode and an emitter electrode; a termination region placed around the transistor region; and an extraction region placed between the transistor and the termination region and extracting redundant carriers. A P-type layer is placed on an N-type drift layer in the extraction region. The P-type layer is connected to the emitter electrode. A dummy gate electrode is placed via an insulation film on the P-type layer. The dummy gate electrode is connected to the gate electrode. Life time of carriers in the termination region is shorter than life time of carriers in the transistor region and the extraction region.
1. A semiconductor device comprising:
a transistor region including an IGBT having a gate electrode and an emitter electrode;
a termination region placed around the transistor region; and
an extraction region placed between the transistor and the termination region and extracting redundant carriers,
wherein a P-type layer is placed on an N-type drift layer in the extraction region,
the P-type layer is connected to the emitter electrode,
a dummy gate electrode is placed via an insulation film on the P-type layer,
the dummy gate electrode is connected to the gate electrode,
life time of carriers in the termination region is shorter than life time of carriers in the transistor region and the extraction region.
2. The semiconductor device according to claim 1 , wherein density of lattice defect in the termination region is higher than density of lattice defect in the transistor region and the extraction region.
3. A semiconductor device comprising:
a transistor region including an IGBT having a gate electrode and an emitter electrode;
a termination region placed around the transistor region; and
an extraction region placed between the transistor and the termination region and extracting redundant carriers,
wherein a P-type layer is placed on an N-type drift layer in the extraction region,
the P-type layer is connected to the emitter electrode,
a dummy gate electrode is placed via an insulation film on the P-type layer,
the dummy gate electrode is connected to the gate electrode,
a first N-type buffer layer is placed under the N-type drift layer in the transistor region and the extraction region,
a P-type collector layer is placed under the first N-type buffer layer,
a second N-type buffer layer is placed under the N-type drift layer in the termination region, and
a collector electrode is directly connected to the P-type collector layer and the second N-type buffer layer.