Solid-state imaging device, method of manufacturing the same, and electronic apparatus

1. A solid-state imaging device comprising: a pixel having a photodiode and a pixel transistor; a first isolation region using a semiconductor region containing impurities formed between neighboring photodiodes; and a second isolation region using a semiconductor region containing impurities formed between the photodiode and the pixel transistor, wherein the second isolation region is in contact with the photodiode and the pixel transistor, and wherein an impurity concentration of the first isolation region is different from an impurity concentration of the second isolation region.

2. The solid-state imaging device according to claim 1 , wherein the impurity concentration of the first isolation region is lower than the impurity concentration of the second isolation region.

3. The solid-state imaging device according to claim 1 , wherein a third isolation region using an STI structure is provided between the second isolation region and the pixel transistor, and the impurity concentration of the second isolation region is lower than the impurity concentration of the first isolation region.

4. The solid-state imaging device according to any one of claims 1 to 3 , wherein the pixel includes a pixel sharing unit where a plurality of photodiodes shares a single pixel transistor group excluding a transfer transistor.

5. The solid-state imaging device according to any one of claims 1 to 3 , wherein the pixel include a unit pixel having a photodiode and a plurality of pixel transistors.

6. A solid-state imaging device comprising: a pixel having a photodiode and a pixel transistor; a first isolation region using a semiconductor region containing impurities formed between neighboring photodiodes; and a second isolation region using a semiconductor region containing impurities formed between the photodiode and the pixel transistor,

wherein, an impurity concentration of the first isolation region is different from an impurity concentration of the second isolation region, wherein the impurity concentration of the first isolation region is lower than the impurity concentration of the second isolation region, and

wherein the second isolation region is formed between a source/drain region of the pixel transistor and the photodiode, and the first isolation region extends between a gate electrode of the pixel transistor and the photodiode.

7. A method of manufacturing a solid-state imaging device, the method comprising the steps of: forming a pixel including a photodiode and a pixel transistor; forming a first isolation region using a semiconductor region containing impurities between neighboring photodiodes; and forming a second isolation region having an impurity concentration different from that of the first isolation region between the photodiode and the pixel transistor, wherein the second isolation region is in contact with the photodiode and the pixel transistor.

8. The method according to claim 7 , further comprising the steps of: forming the first isolation region by collectively performing a first impurity ion implantation process for a gap between the neighboring photodiodes and a gap between the photodiode and the pixel transistor; and forming the second isolation region having a higher impurity concentration that that of the first isolation region by performing a second impurity ion implantation between the photodiode and the pixel transistor.

9. The method according to claim 7 , further comprising a step of forming the first isolation region and the second isolation region having an impurity concentration higher than that of the first isolation region by separately performing impurity ion implantation between the neighboring photodiodes and impurity ion implantation between the photodiode and the pixel transistor.

10. The method according to claim 7 , further comprising the steps of: forming a third isolation region with an STI structure for isolating between the photodiode and the pixel transistor; and forming the first isolation region by implanting impurity ions between the neighboring photodiodes and forming the second isolation region having an impurity concentration lower than that of the first isolation region between the third isolation region and the photodiode.

11. The method according to any one of claims 7 to 10 , wherein the pixel is formed as a pixel sharing unit in which a plurality of photodiodes shares a single pixel transistor group other than a transfer transistor.

12. The method according to any one of claims 7 to 10 , wherein the pixel is formed as a unit pixel including a photodiode and a plurality of pixel transistors.

13. A method of manufacturing a solid-state imaging device, the method comprising the steps of: forming a pixel including a photodiode and a pixel transistor; forming a first isolation region using a semiconductor region containing impurities between neighboring photodiodes; and forming a second isolation region having an impurity concentration different from that of the first isolation region between the photodiode and the pixel transistor,

further comprising the steps of: forming the first isolation region by collectively performing a first impurity ion implantation process for a gap between the neighboring photodiodes and a gap between the photodiode and the pixel transistor; and forming the second isolation region having a higher impurity concentration that that of the first isolation region by performing a second impurity ion implantation between the photodiode and the pixel transistor,

wherein the second impurity ion implantation process is performed for a gap between the photodiode and a source/drain region excluding a gap between the photodiode and the gate electrode of the pixel transistor to form the second isolation region between the photodiode and the source/drain region.

14. An electronic apparatus comprising: (a) a solid-state imaging device comprising (1) a pixel having a photodiode and a pixel transistor, (2) a first isolation region using a semiconductor region containing impurities formed between neighboring photodiodes, and (3) a second isolation region using a semiconductor region containing impurities formed between the photodiode and the pixel transistor, wherein the second isolation region is in contact with the photodiode and the pixel transistor, an impurity concentration of the first isolation region being different from an impurity concentration of the second isolation region: (b) an optical system that guides incident light to a photodiode of the solid-state imaging device; and (c) a signal processing circuit that processes an output signal from the solid-state imaging device.