Laminated glazing panel
A laminated glazing panel includes two glass plies and a plastic ply having one or more light emitting diodes mounted on a circuit board laminated between the glass plies, forming an LED device. The circuit board is ordinarily a flexible circuit board that includes a substrate and a conductive layer. A plurality of light emitting diodes may be mounted on the flexible circuit board and laminated between the glass plies The resultant glazing panel may further include indicia on at least one ply. Processes for the production of a laminated glazing panel involve positioning an LED device in a cut-out in a plastic ply and interleaving the plastic ply between two glass plies, prior to laminating the plies. One or more plastic plies may be used, and the LED device may be coated in a plastic material.
1. A process for the production of a laminated glazing panel comprising pairing together two plastic plies, preparing a cut-out area in the upper plastic ply to receive a circuit board on which one or more light emitting diodes are mounted, positioning said circuit board in the cut-out area, joining a further plastic ply to the paired plastic plies, thereby creating a composite ply, interleaving the composite ply between two glass plies, and laminating the two glass plies and the composite ply, including the circuit board on which is mounted the one or more light emitting diodes, at a temperature of about 100° C. to 150° C.
2. A process for the production of a laminated glazing panel according to claim 1 wherein the circuit board and one or more light emitting diodes together are at least partially coated with a material compatible with the material of the plastic ply.
3. A process for the production of a laminated glazing panel according to claim 1 wherein the two plastic plies that are paired together are made of polyvinylbutyral (PVB).
4. A process for the production of a laminated glazing panel according to claim 1 wherein the two glass plies and the composite ply including the circuit board on which the one or more light emitting diodes are mounted are laminated at a pressure of about 5 to 15 atmospheres.
5. A process for the production of a laminated glazing panel according to claim 1 wherein the laminated glazing panel possesses a thickness equal to or less than 8 mm.
6. A laminated glazing panel comprising two glass plies, a plastic ply and a light emitting diode device laminated between the glass plies, the light emitting diode device which is laminated between the glass plies comprising one or more light emitting diodes mounted on a circuit board, wherein the glass plies and the plastic ply with the one or more light emitting diodes are laminated at a temperature of about 100° C. to 150° C., wherein the laminated glazing panel possesses a thickness of 8 mm or less, and the light emitting diode device possesses a thickness less than 0.8 mm;
wherein the thickness of the light emitting diode device is less than the thickness of the plastic ply.
7. A laminated glazing panel as claimed in claim 6 wherein the circuit board comprises a substrate and a conductive layer.
8. A laminated glazing panel as claimed in claim 6 wherein the circuit board is a flexible circuit board comprising a substrate and a conductive layer.
9. A laminated glazing panel as claimed in claim 8 wherein the substrate comprises polyimide.
10. A laminated glazing panel as claimed in claim 8 wherein the substrate comprises polyester.
11. A laminated glazing panel as claimed in claim 8 wherein the conductive layer is a metal foil which is adhered to the substrate.
12. A laminated glazing panel as claimed in claim 8 wherein the conductive layer is conductive ink which is in direct contact with the substrate.
13. A laminated glazing panel comprising two glass plies, a plastic ply and a light emitting diode device laminated between the glass plies, the light emitting diode device which is laminated between the glass plies comprising one or more light emitting diodes mounted on a circuit board, wherein the glass plies and the plastic ply with the one or more light emitting diodes are laminated at a temperature of about 100° C. to 150° C., wherein the light emitting diode device possesses a thickness less than 0.8 mm, wherein the thickness of the light emitting diode device is less than the thickness of the plastic ply.
14. A laminated glazing panel as claimed in claim 13 wherein the circuit board comprises a substrate and a conductive layer.
15. A laminated glazing panel comprising two glass plies, a plastic ply and a light emitting diode device laminated between the glass plies, the light emitting diode device which is laminated between the glass plies comprising one or more light emitting diodes mounted on a substrate, wherein the glass plies and the plastic ply with the one or more light emitting diodes are laminated at a temperature of about 100° C. to 150° C., wherein the light emitting diode device possesses a thickness less than 0.8 mm, wherein the thickness of the light emitting diode device is less than the thickness of the plastic ply.
16. A laminated glazing panel as claimed in claim 15 further comprising a conductive layer on the substrate.
17. A laminated glazing panel as claimed in claim 15 further comprising a conductive layer adhered to the substrate.