Photonics chip with efficient optical alignment and bonding and optical apparatus including the same

1. A photonics chip comprising:

a substrate having a surface;

an optical waveguide formed on the surface of the substrate;

at least one optical coupler formed on the optical waveguide; and

a plurality of alignment units provided on the surface of the substrate,

wherein the plurality of alignment units align the optical waveguide with an optical connector, which fixes at least one optical fiber, on the substrate, and

wherein at least one optical fiber is coupled to a corresponding optical coupler.

2. The photonics chip of claim 1 , wherein the alignment units comprise a plurality of solder balls formed on the substrate.

3. The photonics chip of claim 2 , wherein the solder balls are formed at both sides of the optical coupler.

4. The photonics chip of claim 3 , wherein the solder balls and the optical couplers are formed on the same line.

5. The photonics chip of claim 4 , wherein the optical connector comprises a plurality of holes into which the solder balls are inserted.

6. The photonics chip of claim 2 , wherein the alignment units further comprise a plurality of pads disposed in at least one of an upper portion and lower portion of the solder balls.

7. An optical apparatus comprising:

an optical fiber;

an optical connector fixing the optical fiber, the optical connector having a plurality of first holes and a plurality of second holes; and

a photonics chip comprising:

a substrate having a surface;

an optical waveguide formed on the surface of the substrate;

at least one optical coupler formed on the optical waveguide; and

a plurality of alignment units provided on the surface of the substrate, aligning the optical connector on the substrate;

wherein the optical fiber passes through the first holes, the first holes being inclined at an angle of 0 to 50 degrees with respect to a direction perpendicular to the surface of the substrate; and

wherein the alignment units are inserted into the second holes, the second holes being perpendicular to the surface of the substrate.

8. The optical apparatus of claim 7 , wherein the optical connector comprises at least one ferrule aligning the optical fiber, and a block surrounding the at least one ferrule.

9. The optical apparatus of claim 8 , wherein the at least one ferrule comprises an upper ferrule and a lower ferrule.

10. The optical apparatus of claim 9 , wherein each of the upper and lower ferrules comprises the plurality of first holes and the plurality of second holes formed outside the first holes.

11. The optical apparatus of claim 7 , further comprising a plurality of guide pins inserted into the second holes on the alignment units.

12. The optical apparatus of claim 11 , wherein the second holes comprise a trench into which the guide pins are inserted at an upper portion of the lower ferrule.

13. The optical apparatus of claim 12 , wherein the lower ferrule has a flat surface supporting the alignment units at a lower portion of the second holes.

14. The optical apparatus of claim 13 , wherein the photonics chip and the optical connector are flip-chip bonded by the alignment units.

15. The optical apparatus of claim 10 , wherein the block fixes the upper and lower ferrules in parallel.

16. The optical apparatus of claim 15 , wherein the block comprises a plurality of housing frames fixing the upper and lower ferrules to be inclined with respect to the substrate, a plurality of connection frames connecting the housing frame, and a plurality of ferrule fixing frames supporting the upper and lower ferrules in the housing frames.

17. The optical apparatus of claim 16 , wherein the ferrule fixing frames separate the upper ferrule from the lower ferrule in parallel.