Silicon single crystal wafer for IGBT and method for manufacturing silicon single crystal wafer for IGBT
In this silicon single crystal wafer for IGBT, COP defects and dislocation clusters are eliminated from the entire region in the radial direction of the crystal, the interstitial oxygen concentration is 8.5×10 17 atoms/cm 3 or less, and variation in resistivity within the wafer surface is 5% or less. This method for manufacturing a silicon single crystal wafer for IGBT includes introducing a hydrogen atom-containing substance into an atmospheric gas at a hydrogen gas equivalent partial pressure of 40 to 400 Pa, and growing a single crystal having an interstitial oxygen concentration of 8.5×10 17 atoms/cm 3 or less at a silicon single crystal pulling speed enabling pulling of a silicon single crystal free of grown-in defects. The pulled silicon single crystal is irradiated with neutrons so as to dope with phosphorous; or an n-type dopant is added to the silicon melt; or phosphorous is added to the silicon melt so that the phosphorous concentration in the silicon single crystal is 2.9×10 13 to 2.9×10 15 atoms/cm 3 and a p-type dopant having a segregation coefficient smaller than that of the phosphorous is added to the silicon melt so that the concentration in the silicon single crystals is 1×10 13 to 1×10 15 atoms/cm 3 corresponding to the segregation coefficient thereof.
1. A silicon single crystal wafer for IGBT comprising a silicon single crystal grown by the Czochralski method, wherein COP defects and dislocation clusters are eliminated from the entire region in the radial direction of the crystal, the interstitial oxygen concentration is 8.5×10 17 atoms/cm 3 or less, the silicon single crystal is doped with an n-type dopant and a p-type dopant having a smaller segregation coefficient than that of phosphorous contained at a concentration of 1×10 13 to 1×10 15 atoms/cm 3 , respectively, and variation in resistivity within the wafer surface is 5% or less.
2. The silicon single crystal wafer for IGBT according to claim 1 , wherein the silicon single crystal is grown at a pulling speed that allows pulling of silicon single crystal free of grown-in defects when grown by the Czochralski method, and is doped with phosphorous by carrying out neutron irradiation on the silicon single crystal after pulling.
3. The silicon single crystal wafer for IGBT according to claim 1 , wherein the silicon single crystal is grown from a silicon melt doped with phosphorus at a pulling speed enabling pulling of silicon single crystal free of grown-in defects during growth by the Czochralski method.
4. The silicon single crystal wafer for IGBT according to any one of claims 1 to 3 , wherein the silicon single crystal is doped with nitrogen at 1×10 14 atoms/cm 3 to 5×10 15 atoms/cm 3 .
5. The silicon single crystal wafer for IGBT according to claim 1 , wherein the LPD density in the wafer surface is 1 defect/cm 2 or less, and the light etching defect density is 1×10 3 defects/cm 2 or less.
6. The silicon single crystal wafer for IGBT according to any one of claims 1 to 3 , wherein a polycrystalline silicon layer of 50 to 1000 nm is formed on the rear side.