Semiconductor chip device with polymeric filler trench
A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.
1. A method of manufacturing, comprising:
providing a semiconductor chip including an insulating layer, the insulating layer including a trench, the trench having a width and a length, the width being smaller than the length, the trench defined by opposing sidewalls of the insulating layer;
stacking a second semiconductor chip on the first semiconductor chip to leave a gap between the second semiconductor chip and the insulating layer; and
placing a polymeric filler in the gap wherein a portion of the polymeric filler is drawn into the trench.
2. The method of claim 1 , comprising stacking a third semiconductor chip on the second semiconductor chip.
3. The method of claim 1 , comprising forming the trench by removing material from the insulating layer.
4. The method of claim 1 , comprising applying a solder wetting film to the insulating layer outside the trench.
5. The method of claim 4 , comprising applying a solder thermal interface material to the solder wetting film.
6. The method of claim 1 , comprising mounting the first semiconductor chip to a circuit board.
7. The method of claim 5 , comprising placing a heat spreader in thermal contact with the solder thermal interface material.
8. The method of claim 1 , wherein the opposing sidewalls comprise sloped sidewalls.
9. A method of manufacturing, comprising:
applying an insulating layer to a first semiconductor chip, the insulating layer having an upper surface;
forming a trench in the insulating layer, the trench having a width and a length, the width being smaller than the length, the trench being defined by opposing sidewalls of the insulating layer and adapted to receive a polymeric filler; and
wherein the first semiconductor chip is adapted to have a second semiconductor chip stacked thereon to leave a gap between the second semiconductor chip and the insulating layer in which a portion of the polymeric filler is positioned and another portion of the polymeric filler is positioned on the upper surface of the insulating layer.
10. The method of claim 9 , comprising forming the trench by removing material from the insulating layer.
11. The method of claim 9 , comprising applying a solder wetting film to the insulating layer outside the trench.
12. The method of claim 11 , comprising applying a solder thermal interface material to the solder wetting film.
13. The method of claim 9 , comprising mounting the first semiconductor chip to a circuit board.
14. The method of claim 12 , comprising placing a heat spreader in thermal contact with the solder thermal interface material.
15. A method of manufacturing, comprising:
providing a semiconductor chip including an insulating layer, the insulating layer including a trench, the trench having a width and a length, the width being smaller than the length, the trench defined by opposing sidewalls of the insulating layer;
stacking a second semiconductor chip on the first semiconductor chip to leave a gap between the second semiconductor chip and the insulating layer, the second semiconductor chip having an outer wall proximate the trench; and
placing a polymeric filler in the gap wherein a portion of the polymeric filler is drawn into the trench, the trench being operable to restrain movement of the polymeric filler away from the outer wall.
16. The method of claim 15 , wherein the outer wall is positioned directly above the trench.
17. The method of claim 15 , comprising applying a solder wetting film to the insulating layer outside the trench.
18. The method of claim 17 , comprising applying a solder thermal interface material to the solder wetting film.
19. The method of claim 15 , comprising mounting the first semiconductor chip to a circuit board.
20. The method of claim 15 , wherein the placement of the polymeric filler comprises placing a first portion of the polymeric filler, curing or partially curing the first portion, and placing and curing a second portion of the polymeric filler.
21. The method of claim 1 , wherein the placement of the polymeric filler comprises placing a first portion of the polymeric filler, curing or partially curing the first portion, and placing and curing a second portion of the polymeric filler.
22. The method of claim 9 , comprising placing the polymeric filler in the gap.
23. The method of claim 22 , wherein the placement of the polymeric filler comprises placing a first portion of the polymeric filler, curing or partially curing the first portion, and placing and curing a second portion of the polymeric filler.