Flange package for a semiconductor device
In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.
1. An apparatus comprising:
a substrate;
an interposer trench formed within the substrate;
a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon; and
a channel that extends between the interposer trench and the mold lock.
2. The apparatus of claim 1 , wherein the channel connects the interposer trench and the mold lock.
3. The apparatus of claim 2 , wherein the channel extends to a depth shallower than a depth of the interposer trench and a depth of the mold lock.
4. The apparatus of claim 1 , wherein the channel extends from the interposer trench toward the mold lock but remains spaced apart from the mold lock.
5. The apparatus of claim 1 , further comprising a U-shaped trench extending from the interposer trench.
6. An apparatus comprising:
a substrate;
an interposer trench formed within the substrate;
a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon; and
a trench extension extending from the interposer trench, wherein the trench extension and the interposer trench surround a plurality of contacts formed on the substrate.
7. The apparatus of claim 1 , wherein the mold lock surrounds a periphery of the interposer trench.
8. The apparatus of claim 1 , wherein the mold lock comprises a trench within the substrate.
9. The apparatus of claim 8 , wherein the trench comprises a first sidewall portion that forms an oblique angle with respect to a top surface of the substrate such that a floor of the mold lock has a greater width than an opening of the trench nearer the top surface of the substrate.
10. The apparatus of claim 9 , wherein the trench further comprises a second sidewall portion that is substantially perpendicular to the top surface of the substrate.
11. An apparatus comprising:
a substrate;
an interposer trench formed within the substrate;
a mold lock formed within the substrate and about the interposer trench, wherein the mold lock includes an alignment structure formed thereon; and
a first opening on a first side of the substrate and a second opening on a second side of the substrate opposite the first side, wherein both the first opening and the second opening extend entirely through the substrate.
12. A method comprising:
forming an interposer trench within a substrate of a flange; and
forming a mold lock within the substrate about the interposer trench, wherein the mold lock includes one or more alignment structures formed thereon; and
forming a channel that extends between the interposer trench and the mold lock.
13. A method comprising:
forming an interposer trench within a substrate of a flange; and
forming a mold lock within the substrate about the interposer trench, wherein the mold lock includes one or more alignment structures formed thereon; and
wherein said forming an interposer trench and said forming a mold lock are performed during a same processing step.
14. The method of claim 13 , wherein said forming an interposer trench and said forming a mold lock are performed using a same process for removing portions of the substrate.
15. The method of claim 12 , wherein the channel connects the interposer trench and the mold lock.
16. The method of claim 15 , wherein the channel extends to a depth shallower than a depth of the interposer trench and a depth of the mold lock.
17. The method of claim 15 , further comprising:
placing the flange and a leadframe in a mold die; and
introducing a dielectric material to the flange and the leadframe such that the dielectric material is deposited within the interposer trench and the mold lock.
18. The method of claim 17 , further comprising coupling the flange to an interposer, wherein the interposer is coupled to the dielectric material within the interposer trench, and wherein the interposer comprises two or more fingers and one or more holes formed therein coupled with the one or more alignment structures of the flange.
19. The method of claim 18 , further comprising coupling a semiconductor die to the flange and the interposer.
20. The method of claim 19 , wherein the semiconductor die comprises a gate pad and a source pad each formed on a first side of the semiconductor die, wherein a drain pad is disposed on a second side of the semiconductor die opposite to the first side, and wherein the gate pad is coupled to the interposer and the source pad is coupled to the flange.