Patent Assignment
Reel/Frame 037384/0135
Merger
Recorded: 2015-12-30
Pages: 13
Assignor
ESTIVATION PROPERTIES LLC
Executed: 2015-08-26
Assignee
XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(39)
Semiconductor Component and Method of Manufacture
Power Semiconductor Device and Method Therefor
Power Semiconductor Device and Method Therefor
Electrical Stress Protection Apparatus and Method of Manufacture
Rf Power Transistor Having an Encapsulated Chip Package
Semiconductor Structure and Method of Manufacture
Semiconductor Component
Semiconductor Structure and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Transistor Structure Having a Trench Drain
Transistor Structure Having a Conductive Layer Formed Contiguous in a Single Deposition
Transistor Structure Having Dual Shield Layers
Transistor Structure Having Reduced Input Capacitance
Transistor Structure Having an Active Region and a Dielectric Platform Region
Semiconductor Structure and Method of Manufacture
Semiconductor Device Having Different Structures Formed Simultaneously
Semiconductor Structure Having a Unidirectional and a Bidirectional Device and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Semiconductor Structure and Method of Manufacture
Semiconductor Structure
Semiconductor Structure and Method of Manufacture
Sacrificial Pillar Dielectric Platform
Semiconductor Device Having a Diamond Substrate Heat Spreader
Silicon-Germanium-Carbon Semiconductor Structure
Flange Package for a Semiconductor Device
Radio Frequency Power Semiconductor Device Comprising Matrix of Cavities as Dielectric Isolation Structure
Semiconductor Structure Formed Without Requiring Thermal Oxidation
Semiconductor Structure and Method of Manufacture
Transistor Structure Having a Trench Drain
Transistor Structure Having a Trench Drain
Semiconductor Structure and Method of Manufacture
Patent:
45,106 →
Application:
13/649,865 →
Flange Package for a Semiconductor Device
Power Semiconductor Device and Method Therefor
Transistor Structure Having a Trench Drain
Semiconductor Device Having a Diamond Substrate Heat Spreader
Application:
14/525,589 →
Publication:
US 2015/0064848
Power Semiconductor Device and Method Therefor
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2006
From: PAVIO, JEANNE S.
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 017451/0096 →
Assignment of Assignor's Interest
Jun 27, 2006
From: MOLINE, DAN
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 018016/0721 →
Assignment of Assignor's Interest
Jul 5, 2006
From: WHITE, MIKE; BEARDEN, BARRY W.
To: SAFE-T-CARE MANUFACTURING, CO., INC.
Reel/Frame 017880/0187 →
Assignment of Assignor's Interest
Aug 25, 2006
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 018175/0692 →
Assignment of Assignor's Interest
Dec 15, 2006
From: TISCHLER, MICHAEL ALBERT
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 018642/0404 →
Assignment of Assignor's Interest
Aug 7, 2008
From: MOLINE, DANIEL D.
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021358/0922 →
Assignment of Assignor's Interest
Aug 21, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021425/0559 →
Assignment of Assignor's Interest
Oct 13, 2008
From: GOGOI, BISHNU PRASANNA
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021703/0098 →
Assignment of Assignor's Interest
Oct 13, 2008
From: GOGOI, BISHNU PRASANNA
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021703/0080 →
Assignment of Assignor's Interest
Oct 30, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021761/0719 →
Assignment of Assignor's Interest
Oct 30, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021761/0627 →
Assignment of Assignor's Interest
Oct 30, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021761/0588 →
Assignment of Assignor's Interest
Oct 30, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021761/0743 →
Assignment of Assignor's Interest
Oct 30, 2008
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021761/0662 →
Assignment of Assignor's Interest
Nov 12, 2008
From: GOGOI, BISHNU P.
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 021822/0841 →
Assignment of Assignor's Interest
Jan 5, 2009
From: GOGOI, BISHNU
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 022054/0418 →
Assignment of Assignor's Interest
Jan 5, 2009
From: GOGOI, BISHNU
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 022054/0384 →
Assignment of Assignor's Interest
Sep 10, 2009
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 023213/0245 →
Assignment of Assignor's Interest
Sep 10, 2009
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 023213/0292 →
Assignment of Assignor's Interest
Feb 2, 2012
From: DAVIES, ROBERT BRUCE
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 027641/0419 →
Assignment of Assignor's Interest
Jun 28, 2012
From: PAVIO, JEANNE S.
To: HVVI SEMICONDUCTORS, INC.
Reel/Frame 028463/0561 →
Assignment of Assignor's Interest
Jul 26, 2012
From: HVVI SEMICONDUCTOR, INC.
To: ESTIVATION PROPERTIES LLC
Reel/Frame 028644/0109 →
Assignment of Assignor's Interest
May 14, 2013
From: HVVI SEMICONDUCTOR, INC.
To: ESTIVATION PROPERTIES LLC
Reel/Frame 030408/0580 →