Combination substrate
A combination substrate includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple connection pads on the opposite side of the wiring board mounting pads, a second substrate having multiple package substrate mounting pads for loading one or more package substrates and multiple connection pads on the opposite side of the package substrate mounting pads, a resin component filling a space between the first substrate and the second substrate, and multiple component loading pads positioned to load an electronic component between the first substrate and the second substrate and formed on one of the first substrate and the second substrate. The connection pads of the second substrate are electrically connected to the connection pads of the first substrate.
1. A combination substrate comprising:
a first substrate;
a second substrate aligned with the first substrate;
an electronic component positioned between the first substrate and the second substrate; and
a plurality of conductive posts forming a space which accommodates the electronic component between the first substrate and the second substrate, the plurality of conductive posts comprising a plurality of first posts formed on the first substrate and a plurality of second posts formed on the second substrate, the plurality of first posts and the plurality of second posts being joined by a conductive material coated on top and side surfaces of one of the plurality of first posts and the plurality of second posts,
wherein one of the first substrate and the second substrate has a plurality of component loading pads formed on the one of the first substrate and the second substrate and positioned to load the electronic component between the first substrate and the second substrate, the first substrate has a plurality of wiring board mounting pads for installing a printed wiring board and a plurality of connection pads on an opposite side of the plurality of wiring board mounting pads, the second substrate has a plurality of package substrate mounting pads for loading at least one package substrate and a plurality of connection pads on an opposite side of the plurality of package substrate mounting pads, the plurality of conductive posts is electrically connecting the connection pads of the second substrate and the connection pads of the first substrate, and the space between the first substrate and the second substrate is filled with a resin component.
2. The combination substrate according to claim 1 , wherein the resin component comprises a thermosetting resin and an inorganic filler.
3. The combination substrate according to claim 1 , wherein the resin component comprises an underfill agent.
4. The combination substrate according to claim 1 , wherein the package substrate mounting pads are positioned on substantially an entire surface of the second substrate.
5. The combination substrate according to claim 1 , wherein the package substrate mounting pads are regularly positioned and evenly spaced.
6. The combination substrate according to claim 1 , wherein the package substrate mounting pads are positioned in one of a matrix pattern and a lattice pattern.
7. The combination substrate according to claim 1 , wherein the package substrate mounting pads are randomly positioned.
8. The combination substrate according to claim 1 , wherein the package substrate mounting pads are positioned to mount a plurality of package substrates.
9. The combination substrate according to claim 1 , wherein the package substrate mounting pads are round.
10. The combination substrate according to claim 1 , further comprising a plurality of pads for mounting a passive component on the second substrate, wherein the pads for mounting a passive component is provided on a same side of the package substrate mounting pads.
11. The combination substrate according to claim 1 , wherein the plurality of first posts comprises a plurality of metal components, respectively, comprising at least one metal selected from the group consisting of copper, nickel, gold and silver, and the plurality of second posts comprises a plurality of metal components, respectively, comprising at least one metal selected from the group consisting of copper, nickel, gold and silver.
12. The combination substrate according to claim 1 , wherein the conductive material comprises a conductive adhesive.
13. The combination substrate according to claim 1 , wherein the conductive material comprises a solder.
14. The combination substrate according to claim 1 , wherein the plurality of posts comprises a plurality of metal layers electroplated on the connection pads of the first substrate and the second substrate.
15. The combination substrate according to claim 1 , wherein the first substrate has a plurality of vias connecting the wiring board mounting pads and the connection pads in the first substrate, and the second substrate has a plurality of vias connecting the package substrate mounting pads and the connection pads in the second substrate.