IP Library › Granted Patent US 8,619,426
Granted Patent B2
US 8,619,426 · App. 13/776,300 · Granted Dec 31, 2013

System, apparatus and method for cooling electronic components

Inventors: Ahmad Chamseddine (Round Rock, TX); Mark Wolfe (Round Rock, TX)
Assignee: Dell Products, LP
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Quick Facts
Patent No.
US 8,619,426
App. No.
13/776,300
Filed
Feb 25, 2013
Granted
Dec 31, 2013
Kind
B2
Art Unit
2835
USPC
361/679.47
Abstract

Apparatuses, systems and methods for effective cooling of electronic devices are presented herein. More specifically, embodiments of the present invention comprise one or more heat pipes thermally coupled to electronic components and to a first heat sink and a second heat sink. The heat pipes are constructed to transfer heat generated at the one or more electronic components to the first heat sink and to the second heat sink. The first heat sink is operable to transfer heat energy to the ambient air using dissipation or advection. The second heat sink is able to transfer heat energy to the ambient air using dissipation. A controller is operable to switch between a passive mode of operation and an active mode of operation. The system can operate in a passive mode only in temperatures less than 25 degrees Celsius, can switch operation between a passive mode and an active mode without throttling in temperatures less than 60 degrees Celsius, can switch operation between a passive mode and an active mode in temperatures greater than 60 degrees Celsius while maintaining about 85% or greater maximum processing speed, and can operate in a passive only mode with minimal throttling.

Claims (42)

1. A cooling system comprising:

a passive portion comprising:

one or more heat pipes, wherein each of the one or more heat pipes comprises a first heat pipe portion, wherein the first heat pipe portion is configured for thermal contact with one or more electronic components via a first flexible thermal conducting layer, and the first heat pipe portion is configured for thermal contact with one or more heat sinks via second flexible thermal conducting layer;

a passive portion heat sink thermally connected via a flexible thermal conducting layer to the one or more heat pipes and exposed to the environment, wherein the passive portion heat sink is operable to transfer heat energy to an external environment via convection;

the passive portion heat sink formed in a plateau integral to a bottom bezel of an electronic device to provide close proximity of the passive portion heat sink to the one or more electronic components;

an active portion further comprising:

an air flow device coupled to an active portion heat sink thermally connected to the one or more heat pipes and exposed to the external environment, wherein operation of the air flow device increases heat transfer across the active portion heat sink; and

a controller operable to monitor the one or more electronic components for one or more predetermined threshold conditions;

wherein the controller is operable to activate or deactivate the air flow device based on a predetermined condition,

wherein the heat energy generated by the one or more electronic components is transferred to the external environment using only the passive portion when a first predetermined condition is that a chipset temperature is less than a first predetermined threshold temperature.

2. The system of claim 1 wherein the first predetermined threshold temperature is set within a range of temperatures up to 90 degrees Celsius.

3. The system of claim 2 wherein the first predetermined threshold temperature depends on an average processing speed of the one or more electronic components remaining at or above a minimum percentage of the maximum processing speed.

4. The system of claim 1 wherein the heat energy generated by the one or more electronic components is transferred to the external environment using the active portion and the passive portion when a second predetermined threshold condition is that the chipset temperature is greater than a second predetermined threshold temperature.

5. The system of claim 4 wherein when a third predetermined threshold temperature is reached, the controller throttles an average processing speed of the one or more electronic components to a level below a maximum processing speed for the electronic component.

6. The system of claim 1 wherein the bottom bezel of the electronic device is comprised of a material that is thermally conductive to assist the passive portion heat sink to transfer heat energy to the external environment.

7. The system of claim 6 wherein the controller is operable to activate the air flow device when the temperature of the bottom bezel of the electronic device is greater than a predetermined threshold bezel temperature.

8. A cooling system comprising:

a passive portion comprising:

one or more heat pipes, wherein each of the one or more heat pipes comprises a first heat pipe portion, wherein the first heat pipe portion is configured for thermal contact with one or more electronic components via a first flexible thermal conducting layer, and the first heat pipe portion is configured for thermal contact with one or more heat sinks via a second flexible thermal conducting layer;

a passive portion heat sink thermally connected via the flexible thermal conducting layer to the one or more heat pipes and exposed to the environment, wherein the passive portion heat sink is operable to transfer heat energy to an external environment via convection;

a cooling system support structure having mounting points with dampening connectors to secure thermal contact between the first heat pipe portion and the one or more electronic components; and

an active portion further comprising:

an air flow device coupled to an active portion heat sink thermally connected to a second heat pipe portion of the one or more heat pipes and exposed to the external environment, wherein operation of the air flow device increases heat transfer across the active portion heat sink;

wherein the passive portion efficiently transfers heat energy to the environment to minimize activation of the air flow device unless one or more predetermined threshold conditions is met.

9. The system of claim 8 further comprising a controller operable to minimize activation of the air flow device to cycle on less than 20% of operational time of the one or more electronic components and to monitor for one or more predetermined threshold conditions.

10. The system of claim 9 wherein the controller is operable to activate or deactivate the air flow device based on the predetermined condition when the temperature of the one or more electronic components of the electronic device reaches a threshold temperature due to inability of the passive portion to transfer enough heat energy to the environment.

11. The system of claim 8 wherein the flexible thermal conducting layer is in thermal contact with a cold plate integral to the cooling system support structure.

12. The system of claim 8 wherein the flexible thermal conducting layer is in thermal contact with a cold plate that is an extension from the cooling system support structure at the first heat pipe portion.

13. The system of claim 1 wherein the passive portion efficiently transfers heat energy to the environment to minimize activation of the air flow device to cycle on less than 10% of the time when the predetermined condition of the chipset temperature is below a threshold chipset temperature.

14. A cooling system comprising:

a passive portion comprising:

one or more heat pipes, wherein each of the one or more heat pipes comprises a first heat pipe portion, wherein the first heat pipe portion is configured for thermal contact with a first electronic component, and the first heat pipe portion is configured for thermal contact with one or more heat sinks via a first flexible thermal conducting layer;

a first passive portion heat sink thermally connected via the first flexible thermal conducting layer to the one or more heat pipes and exposed to the environment, wherein the first passive portion heat sink is operable to transfer heat energy to an external environment via convection;

the one or more heat pipes, wherein each of the one or more heat pipes comprises a second heat pipe portion, wherein the second heat pipe portion is configured for contact with a second electronic component, and the second heat pipe portion is configured for contact with one or more heat sinks via a second flexible thermal conducting layer;

a second passive portion heat sink separate from the first passive portion heat sink and thermally connected via the second flexible thermal conducting layer to the one or more heat pipes and exposed to the environment, wherein the second passive portion heat sink is operable to transfer heat energy to the external environment via convection;

a cooling system support structure having mounting points with dampening connectors to secure contact between the first heat pipe portion and the first electronic component.

15. The system of claim 14 wherein the cooling system support structure further comprises a mounting point with a dampening connector to secure contact between the second heat pipe portion and the second electronic component.

16. The system of claim 14 wherein the cooling system support structure further comprises an opening to expose the first passive portion heat sink to the external environment.

17. The system of claim 14 further comprising the first passive portion heat sink formed in a plateau integral to a bottom bezel of an electronic device to provide close proximity of the second heat sink to the first electronic component.

18. The system of claim 17 wherein the plateau integral to the bottom bezel forming the first passive portion heat sink further comprises an array of fins within the space formed by the plateau to assist in the transfer of heat energy to the environment.

19. The system of claim 17 wherein the plateau integral to the bottom bezel forming the first passive portion heat sink further comprises a material with greater heat conductivity than a material of the bottom bezel.

20. The system of claim 17 further comprising the second passive portion heat sink formed in a second plateau integral to the bottom bezel of the electronic device to provide close proximity of the second passive portion heat sink to the second electronic component.

Assignments (14)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
Continuity (2)
Continuation 13047512 · Mar 14, 2011
Related Publication 20130168058A1 · Jul 4, 2013