Ohmic electrode for SiC semiconductor, method of manufacturing ohmic electrode for SiC semiconductor, semiconductor device, and method of manufacturing semiconductor device
An ohmic electrode for SiC semiconductor that contains Si and Ni or an ohmic electrode for SiC semiconductor that further contains Au or Pt in addition to Si and Ni is provided. In addition, a method of manufacturing the ohmic electrode for SiC semiconductor, a semiconductor device including the ohmic electrode for SiC semiconductor, and a method of manufacturing the semiconductor device are provided.
1. The ohmic electrode for SiC semiconductor, comprising:
a mixed layer of Si and Ni formed on an SiC semiconductor;
a metal layer implemented by an Au layer or a Pt layer formed on said mixed layer; and
an Ni layer formed on said metal layer, wherein said mixed layer of Si and Ni is in direct physical contact with said SiC semiconductor.
2. A semiconductor device having a p-type SiC semiconductor region and an n-type SiC semiconductor region, characterized in that the ohmic electrode for SiC semiconductor according to claim 1 is formed on said p-type SiC semiconductor region and the ohmic electrode for SiC semiconductor according to claim 1 is formed on said n-type SiC semiconductor region.
3. A method of manufacturing a semiconductor device, characterized in that formation of the ohmic electrode for SiC semiconductor according to claim 1 on a p-type SiC semiconductor region and formation of the ohmic electrode for SiC semiconductor according to claim 4 on an n-type SiC semiconductor region are simultaneously performed.
4. A method of manufacturing an ohmic electrode for SiC semiconductor, comprising the steps of:
forming an Si layer on an SiC semiconductor to come in direct physical contact with said SiC semiconductor; and
performing heat treatment of said mixed layer.
5. The method of manufacturing an ohmic electrode for SiC semiconductor according to claim 4 , wherein
a ratio between number of Si atoms and number of Ni atoms (number of Si atoms/number of Ni atoms) in said mixed layer is not smaller than 0.9 and not greater than 1.1.
6. A method of manufacturing an ohmic electrode for SiC semiconductor, comprising the steps of:
forming a first Ni layer on an SiC semiconductor to come in direct physical contact with said SiC semiconductor;
forming a metal layer implemented by an Au layer or a Pt layer on said first Ni layer;
forming a second Ni layer on said metal layer; and
performing heat treatment of a stack of said first Ni layer, said metal layer, and said second Ni layer.
7. A method of manufacturing an ohmic electrode for SiC semiconductor, comprising the steps of:
forming an Si layer on an SiC semiconductor;
forming a first Ni layer on said Si layer;
forming a metal layer implemented by an Au layer or a Pt layer on said first Ni layer;
forming a second Ni layer on said metal layer; and
performing heat treatment of a stack of said Si layer, said first Ni layer, said metal layer, and said second Ni layer.
8. The method of manufacturing an ohmic electrode for SiC semiconductor according to claim 7 , wherein
a ratio between number of Si atoms forming said Si layer and number of Ni atoms forming said first Ni layer (number of Si atoms/number of Ni atoms) is not smaller than 0.9 and not greater than 1.1.
9. A method of manufacturing an ohmic electrode for SiC semiconductor, comprising the steps of:
forming a mixed layer of Si and Ni on an SiC semiconductor;
forming a metal layer implemented by an Au layer or a Pt layer on said mixed layer;
forming an Ni layer on said metal layer; and
performing heat treatment of a stack of said mixed layer, said metal layer, and said Ni layer.
10. The method of manufacturing an ohmic electrode for SiC semiconductor according to claim 9 , wherein
a ratio between number of Si atoms and number of Ni atoms (number of Si atoms/number of Ni atoms) in said mixed layer is not smaller than 0.9 and not greater than 1.1.