Semiconductor device with low resistance SiC-metal contact
A semiconductor device according to an embodiment includes a first electrode and a first silicon carbide (SiC) semiconductor part. The first electrode uses a conductive material and the first silicon carbide (SiC) semiconductor part is connected to the first electrode, in which at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) is contained in an interface portion with the first electrode in such a way that a surface density thereof peaks, and whose conduction type is a p-type.
1. A semiconductor device, comprising:
a first electrode using a conductive material;
a first silicon carbide (SiC) semiconductor part connected to the first electrode, in which at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) is contained in an interface portion with the first electrode in such a way that a surface density thereof peaks, and whose conduction type is p-type; and
a second SiC semiconductor part connected to the first electrode, in which at least one element of sulfur (S), selenium (Se), and tellurium (Te) is contained in an interface portion with the first electrode in such a way that a surface density thereof peaks, and whose conduction type is n-type.
2. The device according to claim 1 , further comprising:
an SiC semiconductor substrate;
an n-type SiC semiconductor layer formed on the SiC semiconductor substrate;
a plurality of third SiC semiconductor parts selectively formed on at least a portion of the n-type SiC semiconductor layer and arranged by being connected to the first and second SiC semiconductor parts, wherein each of the plurality of third SiC semiconductor parts has a p-type conduction type;
a gate dielectric film formed on the second and third SiC semiconductor parts;
a second electrode formed on the gate dielectric film; and
a third electrode formed on a back surface of the SiC semiconductor substrate.
3. The device according to claim 2 , wherein the SiC semiconductor substrate has an n-type conduction type.
4. The device according to claim 3 , wherein the SiC semiconductor substrate contains at least one element of sulfur (S), selenium (Se), and tellurium (Te) in an interface portion with the third electrode in such a way that a surface density thereof peaks.
5. The device according to claim 2 , wherein the SiC semiconductor substrate has a p-type conduction type.
6. The device according to claim 5 , wherein the SiC semiconductor substrate contains at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) in an interface portion with the third electrode in such a way that a surface density thereof peaks.
7. The device according to claim 1 , wherein the first SiC semiconductor part is an SiC semiconductor substrate whose conduction type is p-type.
8. A semiconductor device, comprising:
a first electrode using a conductive material;
a first silicon carbide (SiC) semiconductor part connected to the first electrode, in which at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) is contained in an interface portion with the first electrode in such a way that a suface density thereof peaks, and whose conduction type is p-type;
a second SiC semiconductor part connected to the first electrode and whose conduction type is n-type;
an SiC semiconductor substrate;
an n-type SiC semiconductor layer formed on the SiC semiconductor substrate;
a plurality of third SiC semiconductor parts selectively formed on at least a portion of the n-type SiC semiconductor layer and arranged by being connected to the first and second SiC semiconductor parts, wherein each of the plurality of third SiC semiconductor parts has a p-type conduction type;
a gate dielectric film formed on the second and third SiC semiconductor parts;
a second electrode formed on the gate dielectric film; and
a third electrode formed on a back surface of the SiC semiconductor substrate.
9. The device according to claim 8 , wherein the SiC semiconductor substrate has an n-type conduction type.
10. The device according to claim 9 , wherein the SiC semiconductor substrate contains at least one element of sulfur (S), selenium (Se), and tellurium (Te) in an interface portion with the third electrode in such a way that a surface density thereof peaks.
11. The device according to claim 8 , wherein the SiC semiconductor substrate has a p-type conduction type.
12. The device according to claim 11 , wherein the SiC semiconductor substrate contains at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) in an interface portion with the third electrode in such a way that a surface density thereof peaks.
13. A semiconductor device, comprising:
an electrode using a conductive material; and
a silicon carbide (SiC) semiconductor part connected to the electrode, in which at least one element of sulfur (S), selenium (Se), and tellurium (Te) is contained in an interface portion with the electrode in such a way that a surface density thereof peaks, and whose conduction type is n-type.
14. The device according to claim 13 , wherein the SiC semiconductor part is an SiC semiconductor substrate whose conduction type is n-type.
15. The device according to claim 13 , wherein the electrode is a first electrode, further comprising:
an SiC semiconductor substrate whose conduction type is n-type; and
a second electrode formed on a back surface of the SiC semiconductor substrate,
wherein the SiC semiconductor part is formed above the SiC semiconductor substrate.
16. The device according to claim 15 , wherein the SiC semiconductor substrate contains at least one element of sulfur (S), selenium (Se), and tellurium (Te) in an interface portion with the second electrode in such a way that a surface density thereof peaks.
17. The device according to claim 13 , wherein the electrode is a first electrode, further comprising:
an SiC semiconductor substrate whose conduction type is p-type; and
a second electrode formed on a back surface of the SiC semiconductor substrate,
wherein the SiC semiconductor part is formed above the SiC semiconductor substrate.
18. The device according to claim 17 , wherein the SiC semiconductor substrate contains at least one element of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba) in an interface portion with the second electrode in such a way that a surface density thereof peaks.