IP Library › Granted Patent US 8,624,279
Granted Patent B2
US 8,624,279 · App. 13/472,480 · Granted Jan 7, 2014

Light emitting diode substrate and light emitting diode

Inventors: Bo-Hsiang Tseng (Hsinchu, TW); Yi-Shan Hsieh (Hsinchu, TW); Bo-Wen Lin (Hsinchu, TW); Kun-Lin Yang (Hsinchu, TW); Chun-Yen Peng (Hsinchu, TW); Wen-Ching Hsu (Hsinchu, TW)
Assignee: Sino-American Silicon Products Inc.
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Quick Facts
Patent No.
US 8,624,279
App. No.
13/472,480
Granted
Jan 7, 2014
Kind
B2
Abstract

A light emitting diode (LED) substrate includes a sapphire substrate which is characterized by having a surface consisting of irregular hexagonal pyramid structures, wherein a pitch of the irregular hexagonal pyramid structure is less than 10 μm. A symmetrical cross-sectional plane of each of the irregular hexagonal pyramid structures has a first base angle and a second base angle, wherein the second base angle is larger than the first base angle, and the second base angle is 50° to 70°. This LED substrate has high light-emitting efficiency.

Claims (36)

1. A light emitting diode substrate, comprising:

a sapphire substrate, and a surface of the sapphire substrate comprises a plurality of irregular hexagonal pyramid structures, and a pitch of the plurality of irregular hexagonal pyramid structures being less than 10 μm, wherein a symmetrical cross-sectional plane of each of the irregular hexagonal pyramid structures comprises a first base angle and a second base angle, and the second base angle is greater than the first base angle, and the second base angle is between 50 to 70 degrees.

2. The light emitting diode substrate of claim 1 , wherein the pitch is between about 0.1 μm to 3 μm.

3. The light emitting diode substrate of claim 1 , wherein a maximum height of each of the irregular hexagonal pyramid structures is between 1 μm to 2 μm.

4. The light emitting diode substrate of claim 1 , wherein a top part of each of the irregular hexagonal pyramid structures is a plane or a pointed tip.

5. The light emitting diode substrate of claim 1 , wherein the surface includes a (0001) surface, and the (0001) surface is about 10% to 60% of a projected area of the surface.

6. A light emitting diode, comprising:

a sapphire substrate, comprising a surface constructed with a plurality of irregular hexagonal pyramid structures, and a pitch of the plurality of irregular hexagonal pyramid structures being less than 10 μm, wherein a symmetrical cross-sectional plane of each of the irregular hexagonal pyramid structures comprises a first base angle and a second base angle, and the second base angle is greater than the first base angle, and the second base angle is between 50 to 70 degrees;

a first semiconductor layer, disposed on the sapphire substrate;

a light emitting layer, disposed on the first semiconductor layer;

a second semiconductor layer, disposed on the light emitting layer;

a first ohmic electrode, in contact with the first semiconductor layer; and

a second ohmic electrode, in contact with the second semiconductor layer.

7. The light emitting diode of claim 6 , wherein the pitch is between about 0.1 μm to 3 μm.

8. The light emitting diode of claim 6 , wherein a maximum height of each of the irregular hexagonal pyramid structures is between 1 μm to 2 μm.

9. The light emitting diode of claim 6 , wherein a top part of the each of the irregular hexagonal pyramid structures is a plane or a pointed tip.

10. The light emitting diode of claim 6 , wherein the surface includes a (0001) surface, and the (0001) surface is about 10% to 60% of a projected area of the surface.

11. A light emitting diode substrate, comprising:

a sapphire substrate, and a surface of the sapphire substrate comprises a plurality of pyramid structures, wherein

each of the pyramid structures has a bottom surface with a plurality of acute angles, and each of the pyramid structures is a tetrahedron,

each of the acute angles in one pyramid structure is close to the acute angles of adjacent pyramid structures.

12. The light emitting diode substrate of claim 11 , wherein the surface of the sapphire substrate includes a (0001) surface, and the (0001) surface is about 5% to 40% of a projected area of the surface.

13. The light emitting diode substrate of claim 11 , wherein a maximum height of each of the pyramid structures is between 1.5 μm to 2 μm.

14. The light emitting diode substrate of claim 11 , wherein a top part of each of the pyramid structures is a pointed tip.

15. The light emitting diode substrate of claim 14 , further comprising a cover layer disposed on the plane of each of the pyramid structures, wherein a material of the cover layer includes oxide, nitride or silicon.

16. A light emitting diode, comprising:

a sapphire substrate, comprising a surface constructed with a plurality of pyramid structures, and each of the pyramid structures has a bottom surface with a plurality of acute angles, each of the pyramid structures is a tetrahedron, and each of the acute angles in one pyramid structure is close to the acute angles of adjacent pyramid structures;

a first semiconductor layer, disposed on the sapphire substrate;

a light emitting layer, disposed on the first semiconductor layer;

a second semiconductor layer, disposed on the light emitting layer;

a first ohmic electrode, in contact with the first semiconductor layer; and

a second ohmic electrode, in contact with the second semiconductor layer.

17. The light emitting diode of claim 16 , wherein the surface of the sapphire substrate includes a (0001) surface, and the (0001) surface is about 5% to 40% of a projected area of the surface.

18. The light emitting diode of claim 16 , wherein a maximum height of each of the pyramid structures is between 1.5 μm to 2 μm.

19. The light emitting diode of claim 16 , wherein a top part of each of the pyramid structures is a pointed tip.

20. The light emitting diode of claim 19 , further comprising a cover layer disposed on the plane of each of the pyramid structures, wherein a material of the cover layer includes oxide, nitride or silicon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SINO-AMERICAN SILICON PRODUCTS INC.
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 056923/0232 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2012
From: TSENG, BO-HSIANG; HSIEH, YI-SHAN; LIN, BO-WEN; YANG, KUN-LIN; PENG, CHUN-YEN; HSU, WEN-CHING
To: SINO-AMERICAN SILICON PRODUCTS INC.
Reel/Frame 028221/0451 →
Priority Claims (2)
TW 100210043 U · Jun 2, 2011 · national
TW 100213825 U · Jul 27, 2011 · national
Continuity (1)
Related Publication 20120305965A1 · Dec 6, 2012