Semiconductor device with a dislocation structure and method of forming the same
View Patent ↗A semiconductor device with bi-layer dislocation and method of fabricating the semiconductor device is disclosed. The exemplary semiconductor device and method for fabricating the semiconductor device enhance carrier mobility. The method includes providing a substrate having a gate stack. The method further includes performing a first pre-amorphous implantation process on the substrate and forming a first stress film over the substrate. The method also includes performing a first annealing process on the substrate and the first stress film. The method further includes performing a second pre-amorphous implantation process on the annealed substrate, forming a second stress film over the substrate and performing a second annealing process on the substrate and the second stress film.
1. A method of manufacturing a semiconductor device, comprising:
providing a substrate including a gate stack having spacers;
performing a first implantation process on the substrate including the gate stack and spacers such that the substrate is amorphized;
forming a first stress film over the amorphized substrate including the gate stack and spacers;
performing a first annealing process on the amorphized substrate and the first stress film such that a first stress region is formed within the substrate;
after forming the first stress region, removing the first stress film and the spacers;
performing a second implantation process on the substrate such that a top portion of the first stress region is amorphized;
forming a second stress film over the amorphized top portion of the first stress region; and
performing a second annealing process on the amorphized top portion of the first stress region and the second stress film such that a second stress region is formed over the first stress region within the substrate.
2. The method of claim 1 further wherein the first and second annealing process includes performing a long range pre-heat.
3. The method of claim 1 wherein performing the first implantation process includes implanting the substrate with silicon (Si) or germanium (Ge) implant species.
4. The method of claim 1 wherein performing the first implantation process includes utilizing an implantation energy from about 5 KeV to about 40 KeV.
5. The method of claim 1 wherein performing the annealing process includes performing a rapid thermal annealing (RTA) process.
6. The method of claim 5 wherein performing the RTA process includes utilizing a temperature greater than about 900° C.
7. The method of claim 1 wherein performing the annealing process includes performing a millisecond thermal annealing (MSA) process.
8. The method of claim 7 wherein performing the MSA process includes utilizing a temperature greater than about 900° C.
9. The method of claim 2 wherein performing the long range pre-heat includes utilizing a temperature of about 200° C. to about 700° C. and wherein the long range pre-heat is performed for about 50 seconds to about 300 seconds.