IP Library Granted Patent US 8,629,485
Granted Patent B2
US 8,629,485 · App. 13/143,765 · Granted Jan 14, 2014

Semiconductor photodetection element

Inventors: Kazuhisa Yamamura (Hamamatsu, JP); Akira Sakamoto (Hamamatsu, JP); Terumasa Nagano (Hamamatsu, JP); Yasuhito Miyazaki (Hamamatsu, JP); Yasuhito Yoneta (Hamamatsu, JP); Hisanori Suzuki (Hamamatsu, JP); Masaharu Muramatsu (Hamamatsu, JP)
Assignee: Hamamatsu Photonics K.K.
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Quick Facts
Patent No.
US 8,629,485
App. No.
13/143,765
Granted
Jan 14, 2014
Kind
B2
Abstract

A semiconductor photodetection element SP has a silicon substrate 21 comprised of a semiconductor of a first conductivity type, having a first principal surface 21 a and a second principal surface 21 b opposed to each other, and having a semiconductor layer 23 of a second conductivity type formed on the first principal surface 21 a side; and charge transfer electrodes 25 provided on the first principal surface 21 a and adapted to transfer generated charge. In the silicon substrate 21 , an accumulation layer 31 of the first conductivity type having a higher impurity concentration than the silicon substrate 21 is formed on the second principal surface 21 b side and an irregular asperity 10 is formed in a region opposed to at least the semiconductor region 23 , in the second principal surface 21 b . The region where the irregular asperity 10 is formed in the second principal surface 21 b of the silicon substrate 21 is optically exposed.

Claims (15)

1. A semiconductor photodetection element comprising:

a silicon substrate which is comprised of a semiconductor of a first conductivity type, which has a first principal surface and a second principal surface opposed to each other, and which has a semiconductor region of a second conductivity type formed on the first principal surface side; and

a transfer electrode part which is provided on the first principal surface of the silicon substrate and which transfers generated charge,

wherein in the silicon substrate, an accumulation layer of the first conductivity type having a higher impurity concentration than the silicon substrate is formed on the second principal surface side and an irregular asperity is formed in a region opposed to at least the semiconductor region of the second conductivity type, in the second principal surface, and

wherein the region where the irregular asperity is formed in the second principal surface of the silicon substrate is optically exposed.

2. The semiconductor photodetection element according to claim 1 , wherein the irregular asperity is formed in a partial region of the region opposed to the semiconductor region of the second conductivity type.

3. The semiconductor photodetection element according to claim 1 , wherein the silicon substrate is thinned in a portion corresponding to the semiconductor region of the second conductivity type, from the second principal surface side while leaving a peripheral portion around said portion.

4. The semiconductor photodetection element according to claim 1 , wherein a thickness of the accumulation layer of the first conductivity type is larger than a height difference of the irregular asperity.

5. The semiconductor photodetection element according to claim 1 , wherein the silicon substrate has a thickness set to not more than a pixel pitch.

6. A photodiode comprising:

a silicon substrate which is comprised of a semiconductor of a first conductivity type, which has a first principal surface and a second principal surface opposed to each other, and which has a semiconductor region of a second conductivity type formed on the first principal surface side,

wherein in the silicon substrate, an accumulation layer of the first conductivity type having a higher impurity concentration than the silicon substrate is formed on the second principal surface side and an irregular asperity is formed in a region opposed to at least the semiconductor region of the second conductivity type, in the second principal surface, and

wherein the region opposed to the semiconductor region of the second conductivity type, in the second principal surface of the silicon substrate is optically exposed.

7. The photodiode according to claim 6 , wherein the silicon substrate is thinned in a portion corresponding to the semiconductor region of the second conductivity type, from the second principal surface side while leaving a peripheral portion around said portion.

8. The photodiode according to claim 6 , wherein a thickness of the accumulation layer of the first conductivity type is larger than a height difference of the irregular asperity.

Assignments (2)
COURT ORDER Recorded May 27, 2021
From: HAMAMATSU PHOTONICS K.K.
To: SIONYX, LLC
Reel/Frame 056369/0631 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2011
From: YAMAMURA, KAZUHISA; SAKAMOTO, AKIRA; NAGANO, TERUMASA; MIYAZAKI, YASUHITO; YONETA, YASUHITO; SUZUKI, HISANORI; MURAMATSU, MASAHARU
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 026561/0876 →
Priority Claims (2)
JP 2009-041078 · Feb 24, 2009 · national
JP 2009-136408 · Jun 5, 2009 · national
Continuity (1)
Related Publication 20110266644A1 · Nov 3, 2011