CMOS image sensor having anti-absorption layer
A complementary metal-oxide-semiconductor (CMOS) image sensor, including a wiring layer, a photodiode stacked with the wiring layer, a micro-lens stacked on the photodiode, an anti-reflection layer stacked on the photodiode. An anti-absorption layer may be provided between the photodiode and the anti-reflection layer. The photodiode may include a first portion and a second portion. Light may be focused on the first portion by the micro-lens and the second portion may at least partially surround the first portion. A material of the first portion may have a refractive index higher than a refractive index of a material of the second portion. The anti-absorption layer may include a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.
1. A back-side illumination complementary metal-oxide-semiconductor (CMOS) image sensor, comprising:
a wiring layer, the wiring layer including a plurality of metal layers and insulating layers for insulating the plurality of metal layers;
a photodiode on the wiring layer;
an anti-absorption layer on the photodiode; and
an anti-reflection layer on the anti-absorption layer,
wherein the anti-absorption layer includes a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.
2. The CMOS image sensor as claimed in claim 1 , wherein the compound semiconductor passes visible light therethrough.
3. The CMOS image sensor as claimed in claim 1 , wherein the semiconductor includes silicon (Si).
4. The CMOS image sensor as claimed in claim 1 , wherein the compound semiconductor is silicon-carbide (SiC).
5. The CMOS image sensor as claimed in claim 1 , wherein the compound semiconductor is formed on the photodiode by deposition.
6. The CMOS image sensor as claimed in claim 1 , wherein a P-type dopant with high concentration is doped into the anti-absorption layer.
7. The CMOS image sensor as claimed in claim 6 , wherein the P-type dopant includes boron (B).
8. The CMOS image sensor as claimed in claim 1 , further comprising a color filter layer formed on the anti-reflection layer.
9. The CMOS image sensor as claimed in claim 8 , further comprising a micro-lens formed on the color filter layer.
10. A complementary metal-oxide-semiconductor (CMOS) image sensor, comprising:
a micro-lens for receiving light; and
a photodiode including a first portion and a second portion,
wherein light is focused on the first portion by the micro-lens and the second portion at least partially surrounds the first portion,
a material of the first portion has a refractive index higher than a refractive index of a material of the second portion, and either
the material of the first portion includes silicon-germanium (SiGe) and the material of the second portion includes silicon (Si),
or
the material of the first portion includes silicon (Si) and the material of the second portion includes silicon-carbide (SiC).
11. The CMOS image sensor as claimed in claim 10 , wherein the light focused on the first portion is totally reflected at a boundary surface between the first portion and the second portion.
12. The CMOS image sensor as claimed in claim 10 ,
wherein the photodiode includes silicon (Si), and
wherein the material of the first portion has a refractive index higher than a refractive index of the silicon (Si) due to doping or compound semiconductor growth.
13. The CMOS image sensor as claimed in claim 10 ,
wherein the photodiode includes silicon (Si), and
wherein the material of the second portion has a refractive index lower than a refractive index of the silicon due to doping or compound semiconductor growth.
14. The CMOS image sensor as claimed in claim 10 , wherein the first portion is formed at a central portion of the photodiode, and the second portion is formed to surround an upper surface, a lower surface, and side surfaces of the first portion.
15. The CMOS image sensor as claimed in claim 10 , wherein the first portion is formed to pass through the photodiode in a Z-axis direction and the second portion is formed to surround side surfaces of the first portion.
16. The CMOS image sensor as claimed in claim 10 , wherein the CMOS image sensor is one of a back-side illumination CMOS image sensor and a front-side illumination CMOS image sensor.
17. A complementary metal-oxide-semiconductor (CMOS) image sensor, comprising:
a wiring layer;
a photodiode stacked with the wiring layer, the photodiode including a first portion and a second portion;
a micro-lens stacked on the photodiode;
an anti-reflection layer stacked on the photodiode; and
anti-absorption layer between the photodiode and the anti-reflection layer;
wherein:
light is focused on the first portion by the micro-lens and the second portion at least partially surrounds the first portion,
a material of the first portion has a refractive index higher than a refractive index of a material of the second portion, and
the anti-absorption layer includes a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.