Methods and apparatus for magnetic sensor having non-conductive die paddle
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.
1. A device, comprising:
a conductive leadframe;
a non-conductive die paddle positioned in relation to the leadframe;
a die disposed on the die paddle;
at least one electrical connection from the die to the leadframe; and
a magnetic layer with the die to affect magnetic fields proximate the die.
2. The device according to claim 1 , further including a magnetic transducer coupled to the die.
3. The device according to claim 2 , wherein the magnetic transducer forms a part of the die.
4. The device according to claim 1 , further including a back bias magnet.
5. The device according to claim 4 , wherein the back bias magnet is screen printed.
6. The device according to claim 1 , wherein the magnetic layer comprises a soft ferromagnetic material.
7. The device according to claim 1 , wherein the magnetic layer comprises a hard ferromagnetic material.
8. The device according to claim 1 , wherein the magnetic layer comprises a soft ferromagnetic material to provide a flux concentrator.
9. The device according to claim 1 , wherein the die paddle comprises a plastic material.
10. The device according to claim 1 , wherein the device comprises a Hall element.
11. The device according to claim 2 , wherein the magnetic transducer comprises a magnetoresistive element.
12. The device according to claim 1 , wherein the die does not overlap with any of the leadframe.
13. The device according to claim 2 , wherein the magnetic transducer does not overlap with any of the leadframe.
14. A method, comprising:
employing a conductive leadframe;
forming a non-conductive die paddle in relation to the leadframe;
placing a die on the non-conductive die paddle to form an assembly;
forming at least one electrical connection between the die and the leadframe;
overmolding the assembly to form an integrated circuit package; and
forming a magnetic layer aligned with the die.
15. The method according to claim 14 , further including coupling a magnetic transducer to the die.
16. The method according to claim 14 , further including forming the non-conductive die paddle from a plastic material.
17. The method according to claim 15 , further including molding the plastic die paddle.
18. The method according to claim 14 , wherein the magnetic layer comprises a hard ferromagnetic material.
19. The method according to claim 14 , wherein the magnetic layer comprises a soft ferromagnetic material.
20. The method according to claim 14 , wherein the leadframe does not overlap with the die.
21. The method according to claim 15 , wherein the magnetic transducer does not overlap with any of the leadframe.
22. The method according to claim 15 , further including molding the magnetic layer within the die paddle.
23. The method according to claim 15 , further including overmolding the die paddle, the die, and the magnetic layer.
24. The method according to claim 14 , further including positioning a Hall element in the die.
25. The method according to claim 14 , further including positioning a magnetoresistive element.