Nozzle plate including permanently bonded fluid channel
A printhead includes a nozzle membrane and a plurality of liquid chambers. Portions of the nozzle membrane define an array of nozzles. The nozzle array includes a length and each nozzle of the nozzle array includes an axis. Each of the plurality of liquid chambers is in fluid communication with a respective one of the nozzles of the nozzle array. Each of the plurality of liquid chambers includes a height dimension and a width dimension. The height dimension extends in a direction parallel to the axis of the respective nozzle. The width dimension extends in a direction along the length of the nozzle array. The height dimension and the width dimension have an aspect ratio of less than or equal to 9:1.
1. A printhead comprising:
a nozzle membrane, portions of the nozzle membrane defining an array of nozzles, the nozzle array including a length, each nozzle of the nozzle array including an axis; and
a plurality of liquid chambers, each of the plurality of liquid chambers being in fluid communication with a respective one of the nozzles of the nozzle array, each of the plurality of liquid chambers including a height dimension and a width dimension, the height dimension extending in a direction parallel to the axis of the respective nozzle, the width dimension extending in a direction along the length of the nozzle array, the height dimension and the width dimension having an aspect ratio of less than or equal to 9:1.
2. The printhead of claim 1 , the plurality of liquid chambers being located in a first substrate, further comprising:
a second substrate including a fluid channel, the second substrate being permanently bonded to the first substrate, the fluid channel being in fluid communication with and common to the plurality of liquid chambers.
3. The printhead of claim 2 , further comprising:
CMOS circuitry included in at least one of the nozzle membrane and the first substrate.
4. The printhead of claim 3 , wherein the permanent bond includes an adhesive that includes a curing temperature that is compatible with the CMOS circuitry.
5. The printhead of claim 1 , the plurality of liquid chambers being located in a first substrate, further comprising:
a second substrate including a segmented fluid channel, the second substrate being permanently bonded to the first substrate, for a given segment of the segmented fluid channel, the segment being in fluid communication with one or a subset of the plurality of liquid chambers.
6. The printhead of claim 5 , further comprising:
CMOS circuitry included in at least one of the nozzle membrane and the first substrate.
7. The printhead of claim 6 , wherein the permanent bond includes an adhesive that includes a curing temperature that is compatible with the CMOS circuitry.
8. The printhead of claim 1 , wherein the nozzle membrane includes a drop forming device.
9. The printhead of claim 8 , wherein the drop forming device includes a resistive heating element associated with one or more nozzles of the array of nozzles.
10. The printhead of claim 8 , wherein the drop forming device includes a piezoelectric device associated with one or more nozzles of the array of nozzles.
11. The printhead of claim 1 , wherein the plurality of liquid chambers are located in a silicon substrate.
12. The printhead of claim 1 , wherein the plurality of liquid chambers includes an elliptical cross section when viewed in the direction parallel to the axis of the respective nozzle, the ellipse including a short dimension and a long dimension, the width dimension being the short dimension of the ellipse.